Thermal and/or optical signature simulating systems and methods of making and using such systems

    公开(公告)号:US11892379B2

    公开(公告)日:2024-02-06

    申请号:US17362176

    申请日:2021-06-29

    IPC分类号: G01M99/00 F41G7/00

    摘要: Countermeasure simulating structures may include (a) a base and (b) one or more separated combustible tracks fixed to the base's surface. The combustible tracks may include thermite and/or other combustible material. The combustible tracks may be shaped to simulate countermeasure flares deployed by a vehicle (e.g., a jet). The countermeasure simulating structure may be incorporated into a countermeasure simulating system that includes (a) an infrared and/or optical sensing system (e.g., like those included in missiles) and (b) a simulator mount holding the countermeasure simulating structure. Countermeasures may be tested in such systems by: (a) arranging an infrared and/or optical sensing system to receive infrared energy and/or visible light emitted by the countermeasure simulating structure; (b) igniting the combustible material of the combustible track such that combustion of the combustible material moves along the combustible track; and (c) determining whether the infrared and/or optical sensing system tracks infrared energy and/or visible emitted by the combustion.

    Developing Object Ontologies and Data Usage Models Using Machine Learning

    公开(公告)号:US20220414136A1

    公开(公告)日:2022-12-29

    申请号:US17358322

    申请日:2021-06-25

    摘要: An enterprise ontology, an application data usage model, and/or cross-application data dependencies may be developed using artificial intelligence. Using pattern recognition and/or information extraction techniques, the artificial intelligence may analyze application source code to identify common DDL or SQL statements to formulate an ontology and/or a usage model for the application. A plurality of application ontologies and/or data usage models may be used to build a semantic hub. The semantic hub may be analyzed to identify data redundancies, data use frequency, potential data quality challenges, and/or data dependencies between applications to produce a data abstraction model that allows legacy applications to communicate with one or more data stores.

    Multi-mission munition adapter
    8.
    发明授权

    公开(公告)号:US11512927B2

    公开(公告)日:2022-11-29

    申请号:US17212706

    申请日:2021-03-25

    发明人: Doug Brindle

    IPC分类号: F41F3/065

    摘要: A multi-mission munition adapter for an aircraft may be configured to attach to a hardpoint and hold a plurality of munitions, such as missiles and bombs. A top of the multi-mission munition adapter may have suspension lugs configured to attach to a hardpoint on an aircraft. Sides of the multi-mission munition adapter may have one or more launcher attachment fittings configured to attach missile launchers. A bottom of the multi-mission munition adapter may have one or more munitions ejector hangers configured to attach air-to-ground munitions ejectors. The adapter may comprise an electrical system that permits an aircraft to communicate with and/or power all functions of the bomb rack, missile launchers, and the weapons employed.

    Infrared Transparent Constructs and Methods of Making Them

    公开(公告)号:US20220228919A1

    公开(公告)日:2022-07-21

    申请号:US17150015

    申请日:2021-01-15

    IPC分类号: G01J5/08

    摘要: Infrared transparent constructs (e.g., infrared transparent windows) may be shaped as a dome (e.g., for an infrared detector system) and/or other desired geometries, such as portions of IR seeker domes. Electrically conductive tracing(s) may be printed in desired shapes and forms, e.g., in the form of EMI shielding, an FSS grid, an anti-static component, electrical connectors, etc., and integrated into the interior of the construct structure. The electrically conductive tracing(s) may be printed between layers of independent infrared transparent window components that are then engaged together to form a window preform. Additionally or alternatively, the electrically conductive tracing(s) may be printed between printed layers of infrared transparent ceramic or plastic material built up to form the window preform. Once formed, the window preform may be sintered, e.g., in an ultrafast high temperature sintering process (and optionally further treated) to produce the final infrared transparent construct.