MOTOR DRIVING DEVICE
    2.
    发明公开

    公开(公告)号:US20240305225A1

    公开(公告)日:2024-09-12

    申请号:US18658498

    申请日:2024-05-08

    IPC分类号: H02P6/17 H02P6/08 H02P6/28

    CPC分类号: H02P6/17 H02P6/08 H02P6/28

    摘要: A motor driving device includes: a rotor position detector that detects a rotor position of the motor; a first waveform generator that generates a first reference waveform based on the rotor position; a second waveform generator that generates a second reference waveform based on the rotor position, the second reference waveform being different from the first reference waveform; a waveform outputter that outputs, as an output waveform, the first reference waveform, the second reference waveform, or a composite waveform of the first reference waveform and the second reference waveform, based on the torque command value; and a current supplier that supplies, to the motor, a motor current generated based on the output waveform. In the motor driving device, the waveform outputter changes a composite ratio between the first reference waveform and the second reference waveform in the composite waveform, according to the torque command value.

    Semiconductor device and semiconductor module

    公开(公告)号:US12080664B2

    公开(公告)日:2024-09-03

    申请号:US18477224

    申请日:2023-09-28

    摘要: A semiconductor device includes: a semiconductor layer; first and second transistors; one or more first source pads and a first gate pad of the first transistor in a first region of the upper surface of the semiconductor layer; and one or more second source pads and a second gate pad of the second transistor in a second region of the upper surface adjacent to the first region in a plan view of the semiconductor layer. In a plan view of the semiconductor layer, a virtual straight line connecting the centers of the first and second gate pads passes through the center of the semiconductor layer and forms a 45 degree angle with each side of the semiconductor layer. An upper surface boundary line between the first and second regions monotonically changes in the directions of extension of the longer and shorter sides of the semiconductor layer.

    HYDROGEN DETECTION DEVICE AND CONTROL METHOD FOR HYDROGEN DETECTION DEVICE

    公开(公告)号:US20240272106A1

    公开(公告)日:2024-08-15

    申请号:US18604130

    申请日:2024-03-13

    IPC分类号: G01N27/12 G01N33/00

    摘要: A hydrogen detection device includes a hydrogen sensor and a detection circuit, wherein the hydrogen sensor includes: a first electrode; a second electrode; a metal oxide layer; a first insulating film (insulating film); a first terminal and a second terminal that are connected, through a via, to an other surface of the second electrode opposite a principal surface of the second electrode; and a third terminal connected, through a via, to an other surface of the first electrode opposite a principal surface of the first electrode, and the detection circuit includes: an ammeter that measures (1) a first resistance value between the first terminal and the second terminal and (2) a second resistance value between the third terminal and at least one of the first terminal or the second terminal; and a control circuit that selectively outputs one of the first resistance value or the second resistance value.

    Manufacturing method and semiconductor device

    公开(公告)号:US12051688B2

    公开(公告)日:2024-07-30

    申请号:US18261796

    申请日:2022-09-27

    摘要: A semiconductor device manufacturing method includes: forming a first groove having depth H in a semiconductor layer; filling the first groove with an oxide film and forming a surface oxide film having thickness a on an upper surface of the semiconductor layer to equalize the oxide film and the surface oxide film in height; forming a second groove having depth h greater than thickness a, from an uppermost surface of a third oxide film; forming gate trenches deeper than depth H, in the semiconductor layer; depositing polysilicon until at least the gate trenches and the second groove are filled with polysilicon; forming a peripheral element by injecting an impurity into polysilicon deposited in the second groove; and making a thickness of the peripheral element equal to depth h by concurrently removing polysilicon deposited in the gate trenches and polysilicon deposited in the second groove until they become equal in height.

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20240250209A1

    公开(公告)日:2024-07-25

    申请号:US18583573

    申请日:2024-02-21

    IPC分类号: H01L33/14 H01L33/32

    CPC分类号: H01L33/145 H01L33/32

    摘要: A nitride semiconductor light-emitting element includes: an n-side semiconductor layer; one or more light-emitting layers disposed above the n-side semiconductor layer; a first barrier layer disposed above the one or more light-emitting layers and including Al; a second barrier layer disposed above the first barrier layer and including Al; a p-side guiding layer disposed above the second barrier layer and having an Al composition ratio smaller than an Al composition ratio of the second barrier layer; an electron blocking layer disposed above the p-side guiding layer, including Mg, and having an Al composition ratio larger than the Al composition ratio of the second barrier layer; and a p-side semiconductor layer disposed above the electron blocking layer.

    VOLTAGE MEASUREMENT DEVICE AND CELL STACK SYSTEM

    公开(公告)号:US20240222820A1

    公开(公告)日:2024-07-04

    申请号:US18602691

    申请日:2024-03-12

    摘要: A voltage measurement device individually detects, in a cell stack of n (n is an integer greater than or equal to two) battery cells connected in series, a voltage of each of the n battery cells, and includes: n+1 resistor elements, first terminals of which are connected to a positive electrode of an upper-end battery cell among the n battery cells, a negative electrode of a lower-end battery cell among the n battery cells, and connection points between the n battery cells; n+1 capacitors, first terminals of which are respectively connected to second terminals of the n+1 resistor elements; and a voltage measurer connected to the second terminals of the n+1 resistor elements. Second terminals of two or more capacitors among the n+1 capacitors are connected to a positive electrode of a k-th battery cell (k is an integer; 1≤k≤n−1) among the n battery cells.

    SOLID-STATE IMAGING DEVICE
    10.
    发明公开

    公开(公告)号:US20240163579A1

    公开(公告)日:2024-05-16

    申请号:US18526611

    申请日:2023-12-01

    摘要: A solid-state imaging device includes: a plurality of pixel circuits arranged in rows and columns; a plurality of selector circuits that each receive, as inputs, two pixel signals corresponding to two columns different from each other; k column AD conversion circuits that perform AD conversion on pixel signals output from the plurality of selector circuits, k being an integer greater than or equal to two; and m column AD conversion circuits that are provided redundantly. In the solid-state imaging device, the plurality of selector circuits selectively exclude, from among the k column AD conversion circuits and the m column AD conversion circuits, m column AD conversion circuits corresponding to m columns adjacent to each other, and associate k pixel signals output from the plurality of pixel circuits with k column AD conversion circuits which have not been excluded.