Photoresist polymeric compound and photoresist resin composition
    1.
    发明授权
    Photoresist polymeric compound and photoresist resin composition 有权
    光阻聚合物和光致抗蚀剂树脂组合物

    公开(公告)号:US06692889B1

    公开(公告)日:2004-02-17

    申请号:US09806857

    申请日:2001-04-05

    IPC分类号: G03F7004

    摘要: A polymeric compound of the invention includes at least one monomer unit selected from the following formulae (I), (II), (III) and (IV): (wherein R1 is a hydrogen atom or a methyl group, R2 and R3 are each a hydrogen atom, a hydroxyl group or a —COOR4 group, where R4 is, e.g., a t-butyl group or a 2-tetrahydropyranyl group; R5 and R6 are each a hydrogen atom, a hydroxyl group or an oxo group; R7, R8 and R9 are each a hydrogen atom or a methyl group; R10 and R11 are each a hydrocarbon group having 1 to 8 carbon atoms; R12, R13 and R14 are each a hydrogen atom, a hydroxyl group or a methyl group, where if all of R12 to R14 are each a hydrogen atom or a hydroxyl group, R10 and R11 are not coincidentally methyl groups) [wherein, when the compound includes, for example, a monomer unit of Formula (III), the compound further includes at least one monomer unit selected from among, for example, a monomer unit represented by the following Formula (V): (wherein R15 and R16 are each a hydrogen atom, a hydroxyl group or a carboxyl group; R17 is a hydroxyl group, an oxo group or a carboxyl group; and R1 has the same meaning as defined above)]. This polymeric compound has high etching resistance, as well as satisfactory transparency, alkali-solubility and adhesion, and is therefore useful as a photoresist resin.

    摘要翻译: 本发明的高分子化合物包括至少一种选自下式(I),(II),(III)和(IV)的单体单元:(其中R 1是氢原子或甲基, 2>和R 3各自为氢原子,羟基或-COOR 4基团,其中R 4为例如叔丁基或2-四氢吡喃基; R 5为氢原子, R 6和R 6各自为氢原子,羟基或氧代基; R 7,R 8和R 9各自为氢原子或甲基; R 10和R 8为氢原子, 11>各自为具有1至8个碳原子的烃基; R 12,R 13和R 14各自为氢原子,羟基或甲基,其中如果全部R 12, 至R 14各自为氢原子或羟基,R 10和R 11不是甲基),其中,当该化合物包括例如式(III)的单体单元时, 该化合物还包括至少一种单体单元,其选自例如由下式(V)表示的单体单元:(其中 R 15和R 16各自为氢原子,羟基或羧基; R 17是羟基,氧代基或羧基; 和R 1具有与上述相同的含义]]。 该高分子化合物具有高耐蚀刻性,以及令人满意的透明度,碱溶性和粘附性,因此可用作光致抗蚀剂树脂。

    Polymeric compound and resin composition for photoresist
    3.
    发明授权
    Polymeric compound and resin composition for photoresist 有权
    用于光致抗蚀剂的聚合物和树脂组合物

    公开(公告)号:US06440636B1

    公开(公告)日:2002-08-27

    申请号:US09703677

    申请日:2000-11-02

    IPC分类号: G03F7004

    摘要: A polymeric compound includes at least one monomeric unit of the following formula (I): wherein R1 is a hydrogen atom or a methyl group; and each of R2 and R3 is independently a hydrogen atom or a hydroxyl group. The polymeric compound may include the monomeric unit and at least one monomeric unit selected from monomeric units represented by the following formulae (IIa) and (IIb): wherein R1 is a hydrogen atom or a methyl group; each of R4 and R5 is, for example, a hydrogen atom, a hydroxyl group, an oxo group, or a carboxyl group, wherein R4 and R5 are not concurrently hydrogen atoms; and each of R7 and R8 is independently a hydrogen atom, a hydroxyl group, or an oxo group. The polymeric compound have a high etching resistance in addition to satisfactory transparency, alkali-solubility, and adhesion.

    摘要翻译: 聚合化合物包括至少一种下式(I)的单体单元:其中R1是氢原子或甲基; R2和R3各自独立地为氢原子或羟基。 聚合化合物可以包括单体单元和选自下式(IIa)和(IIb)表示的单体单元的至少一种单体单元:其中R 1是氢原子或甲基; R4和R5各自为例如氢原子,羟基,氧代基或羧基,其中R4和R5不同时为氢原子; R 7和R 8各自独立地为氢原子,羟基或氧代基。 除了令人满意的透明性,碱溶性和粘合性之外,高分子化合物具有高的耐蚀刻性。

    Polymer for photoresist and resin compositions therefor
    5.
    发明授权
    Polymer for photoresist and resin compositions therefor 有权
    用于光刻胶的聚合物及其树脂组合物

    公开(公告)号:US07105268B2

    公开(公告)日:2006-09-12

    申请号:US10239051

    申请日:2001-12-11

    摘要: A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): wherein R1, R2, R3, R4 and R5 are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.

    摘要翻译: 本发明的光刻胶用高分子化合物包括至少一种由下式(I)表示的单体单元:其中R 1,R 2,R 3, R 4,R 4和R 5相同或不同,各自为氢原子或甲基; m,p和q分别表示0〜2的整数。 并且n表示0或1,其中从式中的主链延伸的羟基和羰氧基独立地与环的最左部分的两个碳原子中的任一个结合。 通过使用光致抗蚀剂的高分子化合物作为光致抗蚀剂的基底,所得到的光致抗蚀剂表现出对基底的良好的圆形粘附性和耐蚀刻性。

    Dielectric films and materials therefor
    6.
    发明授权
    Dielectric films and materials therefor 失效
    介电薄膜及其材料

    公开(公告)号:US07090925B2

    公开(公告)日:2006-08-15

    申请号:US10807326

    申请日:2004-03-24

    IPC分类号: B32B27/00 C08G73/10

    摘要: A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1):wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y1, Y2, Y3 and Y4 are the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R1 and R2 are each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent

    摘要翻译: 介电膜用材料是含有下述式(1)表示的金刚烷多元羧酸的聚合性组合物:其中X为氢原子,羧基或烃基; 和Y 1,Y 2,Y 3和Y 4相同或不同,并且 各自为单键或二价芳族环基; 由下式(2)表示的芳族多胺:其中环Z是单环或多环芳环; R 1和R 2各自为与环Z结合的取代基,彼此相同或不同,并且各自为氨基,单取代的氨基 基,羟基或巯基; 和除酮和醛之外的溶剂,其中金刚烷多羧酸和芳族多胺溶解在溶剂中

    Radical-polymerizable resin, radical-polymerizable resin composition, and cured material thereof
    8.
    发明授权
    Radical-polymerizable resin, radical-polymerizable resin composition, and cured material thereof 有权
    可自由基聚合树脂,自由基聚合性树脂组合物及其固化物

    公开(公告)号:US08735462B2

    公开(公告)日:2014-05-27

    申请号:US13642363

    申请日:2011-03-28

    IPC分类号: C07D303/40 C08F2/46 C08G61/04

    摘要: Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them.The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 ° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.

    摘要翻译: 提供一种能够赋予令人满意的柔软性的固化物的自由基聚合性树脂,可以在作为粘合剂使用时放松应力,并且不会引起诸如粘合界面处的分离或被粘物的断裂等缺点, 粘合剂和被粘物在加热或冷却时是由它们之间的热膨胀系数的差异引起的。 可通过下述通式(1a)和(1b)中任一项所示的化合物的阳离子聚合和由下式(2a),(2b),(2c),(2d) ,(2e)和(2f)。 可自由基聚合的树脂在0℃下为液体,重均分子量为500以上。 式中的符号如说明书中所定义。

    RADICAL POLYMERIZABLE RESIN, RADICAL POLYMERIZABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
    9.
    发明申请
    RADICAL POLYMERIZABLE RESIN, RADICAL POLYMERIZABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 审中-公开
    自由基聚合树脂,光聚合树脂组合物及其固化产品

    公开(公告)号:US20130035465A1

    公开(公告)日:2013-02-07

    申请号:US13641354

    申请日:2011-04-08

    摘要: Provided is a radically polymerizable resin which has a low viscosity, has excellent workability, and is rapidly cured upon application of heat and/or light to form a cured product having excellent flexibility and thermal stability. The radically polymerizable resin composition is obtained by cationic polymerization of an oxetane-ring-containing (meth)acrylic ester compound represented by following Formula (1) alone or in combination with another cationically polymerizable compound. In Formula (1), R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 4 to 20 carbon atoms.

    摘要翻译: 提供一种具有低粘度,加工性优异的自由基聚合性树脂,并且在施加热和/或光时迅速固化以形成具有优异的柔性和热稳定性的固化产物。 可自由基聚合的树脂组合物通过单独或与另一种阳离子聚合性化合物的组合使由下述式(1)表示的含氧杂环丁烷的(甲基)丙烯酸酯化合物阳离子聚合而得到。 在式(1)中,R 1表示氢原子或甲基; R2表示氢原子或烷基; A表示碳原子数为4〜20的直链或支链亚烷基。

    RADICAL-POLYMERIZABLE RESIN, RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND CURED MATERIAL THEREOF
    10.
    发明申请
    RADICAL-POLYMERIZABLE RESIN, RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND CURED MATERIAL THEREOF 有权
    光学聚合树脂,光聚合树脂组合物及其固化材料

    公开(公告)号:US20130030078A1

    公开(公告)日:2013-01-31

    申请号:US13642363

    申请日:2011-03-28

    IPC分类号: C08G63/66

    摘要: Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them.The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.

    摘要翻译: 提供一种能够赋予令人满意的柔软性的固化物的自由基聚合性树脂,可以在作为粘合剂使用时放松应力,并且不会引起诸如粘合界面处的分离或被粘物的断裂等缺点, 粘合剂和被粘物在加热或冷却时是由它们之间的热膨胀系数的差异引起的。 可通过下述通式(1a)和(1b)中任一项所示的化合物的阳离子聚合和由下式(2a),(2b),(2c),(2d) ,(2e)和(2f)。 可自由基聚合的树脂在0℃下为液体,重均分子量为500以上。 式中的符号如说明书中所定义。