摘要:
A polymeric compound of the invention includes at least one monomer unit selected from the following formulae (I), (II), (III) and (IV): (wherein R1 is a hydrogen atom or a methyl group, R2 and R3 are each a hydrogen atom, a hydroxyl group or a —COOR4 group, where R4 is, e.g., a t-butyl group or a 2-tetrahydropyranyl group; R5 and R6 are each a hydrogen atom, a hydroxyl group or an oxo group; R7, R8 and R9 are each a hydrogen atom or a methyl group; R10 and R11 are each a hydrocarbon group having 1 to 8 carbon atoms; R12, R13 and R14 are each a hydrogen atom, a hydroxyl group or a methyl group, where if all of R12 to R14 are each a hydrogen atom or a hydroxyl group, R10 and R11 are not coincidentally methyl groups) [wherein, when the compound includes, for example, a monomer unit of Formula (III), the compound further includes at least one monomer unit selected from among, for example, a monomer unit represented by the following Formula (V): (wherein R15 and R16 are each a hydrogen atom, a hydroxyl group or a carboxyl group; R17 is a hydroxyl group, an oxo group or a carboxyl group; and R1 has the same meaning as defined above)]. This polymeric compound has high etching resistance, as well as satisfactory transparency, alkali-solubility and adhesion, and is therefore useful as a photoresist resin.
摘要翻译:本发明的高分子化合物包括至少一种选自下式(I),(II),(III)和(IV)的单体单元:(其中R 1是氢原子或甲基, 2>和R 3各自为氢原子,羟基或-COOR 4基团,其中R 4为例如叔丁基或2-四氢吡喃基; R 5为氢原子, R 6和R 6各自为氢原子,羟基或氧代基; R 7,R 8和R 9各自为氢原子或甲基; R 10和R 8为氢原子, 11>各自为具有1至8个碳原子的烃基; R 12,R 13和R 14各自为氢原子,羟基或甲基,其中如果全部R 12, 至R 14各自为氢原子或羟基,R 10和R 11不是甲基),其中,当该化合物包括例如式(III)的单体单元时, 该化合物还包括至少一种单体单元,其选自例如由下式(V)表示的单体单元:(其中 R 15和R 16各自为氢原子,羟基或羧基; R 17是羟基,氧代基或羧基; 和R 1具有与上述相同的含义]]。 该高分子化合物具有高耐蚀刻性,以及令人满意的透明度,碱溶性和粘附性,因此可用作光致抗蚀剂树脂。
摘要:
A photoresist polymeric compound includes a monomer unit represented by following Formula (I): The polymeric compound may further include at least one of monomer units represented by Formulae (IIa) to (IIg) as described in the specification. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.
摘要:
A polymeric compound includes at least one monomeric unit of the following formula (I): wherein R1 is a hydrogen atom or a methyl group; and each of R2 and R3 is independently a hydrogen atom or a hydroxyl group. The polymeric compound may include the monomeric unit and at least one monomeric unit selected from monomeric units represented by the following formulae (IIa) and (IIb): wherein R1 is a hydrogen atom or a methyl group; each of R4 and R5 is, for example, a hydrogen atom, a hydroxyl group, an oxo group, or a carboxyl group, wherein R4 and R5 are not concurrently hydrogen atoms; and each of R7 and R8 is independently a hydrogen atom, a hydroxyl group, or an oxo group. The polymeric compound have a high etching resistance in addition to satisfactory transparency, alkali-solubility, and adhesion.
摘要翻译:聚合化合物包括至少一种下式(I)的单体单元:其中R1是氢原子或甲基; R2和R3各自独立地为氢原子或羟基。 聚合化合物可以包括单体单元和选自下式(IIa)和(IIb)表示的单体单元的至少一种单体单元:其中R 1是氢原子或甲基; R4和R5各自为例如氢原子,羟基,氧代基或羧基,其中R4和R5不同时为氢原子; R 7和R 8各自独立地为氢原子,羟基或氧代基。 除了令人满意的透明性,碱溶性和粘合性之外,高分子化合物具有高的耐蚀刻性。
摘要:
A photoresist polymeric compound includes a monomer unit represented by following Formula (I): The polymeric compound may further include at least one of monomer units represented by Formulae (IIa) to (IIg) as described in the specification. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.
摘要:
A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): wherein R1, R2, R3, R4 and R5 are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.
摘要:
A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1):wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y1, Y2, Y3 and Y4 are the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R1 and R2 are each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent
摘要:
There are disclosed a metal-organic polymer composite structure, particularly a porous metal-organic polymer composite structure, for use as functional materials such as catalysts, and a method for producing the structure. The composite structure is composed of a microphase-separated structure from a block copolymer in which a metalphilic polymer chain and a metalphobic polymer chain are bonded together at each end, and ultrafine metal particles are contained in the metalphilic polymer phase of the microphase-separated structure.
摘要:
Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them.The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 ° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.
摘要:
Provided is a radically polymerizable resin which has a low viscosity, has excellent workability, and is rapidly cured upon application of heat and/or light to form a cured product having excellent flexibility and thermal stability. The radically polymerizable resin composition is obtained by cationic polymerization of an oxetane-ring-containing (meth)acrylic ester compound represented by following Formula (1) alone or in combination with another cationically polymerizable compound. In Formula (1), R1 represents hydrogen atom or methyl group; R2 represents hydrogen atom or an alkyl group; and “A” represents a linear or branched chain alkylene group having 4 to 20 carbon atoms.
摘要:
Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them.The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0° C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description.