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8 条记录 (耗时 0.017 秒)

    ASYMMETRIC ePTFE MEMBRANE
    1.
    发明申请
    ASYMMETRIC ePTFE MEMBRANE 审中-公开
    不对称ePTFE膜

    公开(公告)号：US20130319924A1

    公开(公告)日：2013-12-05

    申请号：US13488682

    申请日：2012-06-05

    申请人： Yit-Hong Tee ,  Vishal Bansal ,  Christopher Keller

    发明人： Yit-Hong Tee ,  Vishal Bansal ,  Christopher Keller

    IPC分类号： B01D71/42 ,  B01D67/00 ,  B01D61/36 ,  B01D71/00 ,  B01D71/06

    CPC分类号： B01D61/364 ,  B01D67/0027 ,  B01D67/0088 ,  B01D67/009 ,  B01D71/36 ,  B01D2323/02

    摘要： A membrane distillation system is provided for distilling liquids. The membrane distillation system includes a heat generating means for heating a non-distilled liquid. The membrane distillation system further includes a microporous membrane that is asymmetric and vapor permeable. The microporous membrane includes a hydrophilic layer and a hydrophobic layer. The membrane distillation system further includes a supply means for delivering the heated non-distilled liquid to the hydrophilic layer of the microporous membrane. A collection means is further provided for collecting distilled liquid from the hydrophobic layer of the microporous membrane. A method of fabricating the microporous membrane for use in the membrane distillation system is also provided.

    摘要翻译： 提供用于蒸馏液体的膜蒸馏系统。 膜蒸馏系统包括用于加热非蒸馏液体的发热装置。 膜蒸馏系统还包括不对称和透气的微孔膜。 微孔膜包括亲水层和疏水层。 膜蒸馏系统还包括用于将加热的未蒸馏液体输送到微多孔膜的亲水层的供给装置。 进一步提供收集装置用于从微多孔膜的疏水层收集蒸馏液。 还提供了制造用于膜蒸馏系统的微孔膜的方法。

    METHOD FOR MAKING HIGH STRENGTH ALUMINUM ALLOY SHEET AND PRODUCTS MADE BY SAME
    4.
    发明申请
    METHOD FOR MAKING HIGH STRENGTH ALUMINUM ALLOY SHEET AND PRODUCTS MADE BY SAME 审中-公开
    制造高强度铝合金板材及其制品的方法

    公开(公告)号：US20090159160A1

    公开(公告)日：2009-06-25

    申请号：US11960928

    申请日：2007-12-20

    申请人： Paul Platek ,  Christopher Keller ,  Shixi Ding ,  David O. Thompson ,  Zhong Li

    发明人： Paul Platek ,  Christopher Keller ,  Shixi Ding ,  David O. Thompson ,  Zhong Li

    IPC分类号： C22F1/047

    CPC分类号： C22F1/047 ,  C22C21/06 ,  C22C21/08

    摘要： Disclosed is a method for producing a non-heat-treatable high strength aluminum sheet from aluminum scraps using a continuous caster. The method includes providing a molten aluminum non-heat-treatable alloy including Si about 0.7% max., Fe about 0.8% max., Cu about 0.3% max., Mn about 0.5-1.2%, Mg about 1.3-2.8%, Zn about 0.20% max., Cr about 0.2% max., Zr about 0.30% max., Sr about 0.30 max., the remainder aluminum, incidental elements and impurities; and continuously casting the molten aluminum alloy into a slab and rolling the slab into a sheet product with high strength and reasonable formability. Typically, the sheet product is used for the products, such as truck trailer siding panel or electrical conduits for the building industry.

    摘要翻译： 公开了一种使用连铸机从铝屑生产不可热处理的高强度铝板的方法。 该方法包括提供熔融铝不可热处理的合金，其包括Si约0.7％，最大约0.8％的Fe，约0.3％的Mn，约0.5-1.2％的Mn，约1.3-2.8％的Mg， 约0.20％最大，Cr约0.2％最大，Zr约0.30％最大，Sr约0.30最大，其余为铝，附带元素和杂质; 并将熔融铝合金连续铸造成板坯，并将板坯轧制成具有高强度和合理成形性的板材。 通常，片材产品用于产品，例如卡车拖车侧板或用于建筑工业的电气管道。

    High speed, high density board to board interconnect
    5.
    发明申请
    High speed, high density board to board interconnect 审中-公开
    高速，高密度板对板互连

    公开(公告)号：US20070252283A1

    公开(公告)日：2007-11-01

    申请号：US11413749

    申请日：2006-04-28

    申请人： Christopher Keller

    发明人： Christopher Keller

    IPC分类号： H01L23/52

    CPC分类号： H05K3/368 ,  H01L2224/14181 ,  H05K1/145 ,  H05K3/3436 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/10378

    摘要： A high speed, high density board to board interconnect structure uses a spacer board and BGA techniques to connect two circuit boards. The spacer board is a standard double-sided FR-4 printed circuit board and are connected to each of the circuit boards by a BGA. This interconnect structure allows high data rate to be passed from one board to another with a board to board spacing of about 1.5 mm. An example of the application of this technique is a 4 channel high speed (over 1 Gb/s) optical transceiver using 2 PCB substrates.

    摘要翻译： 高速，高密度板对板互连结构使用间隔板和BGA技术连接两个电路板。 间隔板是标准的双面FR-4印刷电路板，并通过BGA连接到每个电路板。 这种互连结构允许高数据速率从一个板传递到另一个板，板对板间距约为1.5mm。 这种技术的应用的一个例子是使用2个PCB基板的4通道高速（超过1Gb / s）的光收发器。

    OPTICAL INTERCONNECT DEVICE AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    OPTICAL INTERCONNECT DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    光学互连装置及其制造方法

    公开(公告)号：US20080075405A1

    公开(公告)日：2008-03-27

    申请号：US11857695

    申请日：2007-09-19

    申请人： Dongdong Wang ,  Zhenhua Shao ,  Xu Huang ,  Masataka Ito ,  Christopher Keller

    发明人： Dongdong Wang ,  Zhenhua Shao ,  Xu Huang ,  Masataka Ito ,  Christopher Keller

    IPC分类号： G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/1221 ,  G02B6/4214 ,  G02B6/4224 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10T29/49016 ,  H01L2224/0401

    摘要： An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring.

    摘要翻译： 光学互连装置包括第一基板，第二基板，光波导，电线和开关装置。 第一基板具有电布线电路，用于将电信号转换为光信号的电光转换器，以及用于发光的发光装置。 第二基板具有电线电路，用于将光信号转换为电信号的光电转换器，以及用于从光发射装置接收光的光接收装置。 光波导将发光和光接收装置光学连接。 电线将第一和第二基板的电气布线电连接。 开关装置确定要通过光学基板发送的数据的快速信号和经由电线发送的数据的慢信号。

    MOLD ASSEMBLIES INCLUDING A MOLD INSERTABLE IN A CONTAINER
    8.
    发明申请
    MOLD ASSEMBLIES INCLUDING A MOLD INSERTABLE IN A CONTAINER 审中-公开
    模具组装，包括在集装箱中不可拆卸的模具

    公开(公告)号：US20130313403A1

    公开(公告)日：2013-11-28

    申请号：US13990295

    申请日：2011-11-28

    申请人： William Brian Atkins ,  Gary Eugene Weaver ,  Christopher Keller

    发明人： William Brian Atkins ,  Gary Eugene Weaver ,  Christopher Keller

    IPC分类号： B29C33/42

    CPC分类号： B29C33/42 ,  B22C9/22 ,  B22F5/007 ,  B22F5/009 ,  B33Y80/00 ,  E21B10/00

    摘要： There is disclosed herein a method of designing a mold assembly including a container (300) and a mold (200), at least portions of an outer surface of the mold corresponding to an inner surface of the container such that the container will support the mold therein, in use of the mold for molding an object, the mold assembly defining a mold cavity (252) substantially corresponding to the outer shape of the object to be molded, wherein one or more portions of the mold cavity are defined by the inner surface of the container.

    摘要翻译： 这里公开了一种设计包括容器（300）和模具（200）的模具组件的方法，模具的外表面的至少一部分对应于容器的内表面，使得容器将支撑模具 其中，在使用用于模制物体的模具的情况下，模具组件限定基本对应于待模制物体的外部形状的模腔（252），其中模腔的一个或多个部分由内表面 的容器。