公开(公告)号：US06487027B2

公开(公告)日：2002-11-26

申请号：US09837186

申请日：2001-04-19

申请人： Yasuyuki Yamauchi ,  Toyotoshi Machida ,  Nobuhiro Ninomiya

发明人： Yasuyuki Yamauchi ,  Toyotoshi Machida ,  Nobuhiro Ninomiya

IPC分类号： G02B702

CPC分类号： H01S5/02415 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01S5/0014 ,  H01S5/02276 ,  H01S5/02469 ,  H01S5/0687 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical semiconductor device includes a package body, a laser diode accommodated in the package body, a temperature regulation block connected thermally to the laser diode, an optical filter connected thermally to the temperature regulation block, a photodetector receiving the laser beam from the laser diode via the optical filter, a feeder feeding a driving power to the laser diode, and a thermal conducting body provided separately to the feeder, wherein the thermal conducting body transmits the temperature of the package body to the laser diode.

摘要翻译： 光学半导体器件包括封装体，容纳在封装主体中的激光二极管，与激光二极管热连接的温度调节块，与温度调节块热连接的滤光器，接收来自激光二极管的激光束的光电检测器 通过光学滤波器，向激光二极管馈送驱动电力的馈电器和分别设置在馈电器上的导热体，其中导热体将封装体的温度传递到激光二极管。