摘要:
The present invention provides a method for monitoring a shift in a buried layer in a semiconductor device. The method for monitoring the shift in the buried layer, among other steps, includes forming a buried layer test structure in, on or over a substrate of a semiconductor device, the buried layer test structure including a first test buried layer located in or on the substrate, the first test buried layer shifted a predetermined distance with respect to a first test feature. The buried layer test structure further includes a second test buried layer lodated in the substrate, the second test buried layer shifted a predetermined but different distance with respect to a second test feature. The method for monitoring the shift in the buried layer may further include applying a test signal to the buried layer test structure to determine an actual shift relative to the predetermined shift.
摘要:
A power field effect transistor is disclosed that includes polysilicon gate bodies (40) and (42), which includes platinum silicide contact layers (74) and (78) disposed on the outer surfaces of bodies (40) and (42), respectively. In addition, the device comprises an n+drain region (64) which also has a platinum silicide drain contact layer (76) formed on its outer surface and platinum silicide source contact layers (75) and (77). During formation, sidewall spacers (50) and (52), as well as mask bodies (70) and (72) are used to ensure that platinum silicide layer (76) spaced apart from both gate bodies (40) and (42) and platinum silicide gate contact layers (74) and (78).