PROCESS VARIATION-TOLERANT CASCADED TAPERED OPTICAL RING RESONATORS

    公开(公告)号:US20250164696A1

    公开(公告)日:2025-05-22

    申请号:US18515037

    申请日:2023-11-20

    Applicant: XILINX, INC.

    Abstract: Embodiments herein describe a method for selectively filtering different wavelengths of optical signals received from an optical channel using cascaded ring resonators, each of the cascaded ring resonators having a first ring and a second ring. The first ring has a varying waveguide width along its length configured to form a first waveguide width portion and a second waveguide width portion, the first waveguide width portion having a greater width than the second waveguide width portion. The second ring has a varying waveguide width along its length configured to form a third waveguide width portion and a fourth waveguide width portion, the fourth waveguide width portion having a greater width than the third waveguide width portion. The method further connects receivers to respective cascaded ring resonators, each of the receivers having a photodetector configured to differentiate between the optical signals.

    METHODS AND APPARATUSES FOR WAVELENGTH LOCKING FOR OPTICAL WAVELENGTH DIVISON MULIPLEXED MICRO-RING MODULATORS

    公开(公告)号:US20240405882A1

    公开(公告)日:2024-12-05

    申请号:US18205748

    申请日:2023-06-05

    Applicant: XILINX, INC.

    Abstract: Some examples described herein provide for controlling output modulation amplitude for optoelectronic devices. In an example, a method includes transmitting a data pattern to an optical modulator device. The method also includes identifying, for each heater control value of a plurality of heater control values for a heater thermally coupled with the optical modulator device, an optical modulation amplitude corresponding to the heater control value based on a corresponding photodiode current value identified while transmitting the data pattern. The method also includes determining a maximum optical modulation amplitude for the optical modulator device based on a plurality of optical modulation amplitudes corresponding to the plurality of heater control values according to the identifying. The method also includes controlling the heater based at least in part on the determined maximum optical modulation amplitude that has been modified according to scaling maximum photodiode current values.

    RING MODULATORS WITH LOW-LOSS AND LARGE FREE SPECTRAL RANGE (FSR) ON A SILICON-ON-INSULATOR (SOI) PLATFORM

    公开(公告)号:US20240369864A1

    公开(公告)日:2024-11-07

    申请号:US18143846

    申请日:2023-05-05

    Applicant: XILINX, INC.

    Abstract: A silicon-on-insulator (SOI) dense-wavelength-division-multiplexing (DWDM) device includes micro-ring modulators (MRMs) having radii under 5 micrometers. A 16-channel embodiment may provide a free spectral range of 3.2 THz, 200 GHz channel spacing, 41 GHz bandwidth, and a Q factor of 4500. PN junctions of rib ring waveguides (RWRs) may be perpendicular or parallel with a plane of the RWRs. On-chip inductive components may be used to match reactances of the PN junctions. The RWRs may be relatively wide and a rib bus waveguide may be relatively narrow (e.g., narrower than the RWRs). MRM outer slaps may be wider than inner slabs. Regions inside and outside of the RWRs, including slabs at optical coupling gaps may be doped to improve modulation efficiency. Regions of the rib bus waveguide distant from the optical coupling gaps may be undoped. Cavities may be provided below the MRMs and associated heater elements.

    HETEROGENEOUS INTEGRATION MODULE COMPRISING THERMAL MANAGEMENT APPARATUS

    公开(公告)号:US20210305127A1

    公开(公告)日:2021-09-30

    申请号:US16833034

    申请日:2020-03-27

    Applicant: XILINX, INC.

    Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

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