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公开(公告)号:US10361402B2
公开(公告)日:2019-07-23
申请号:US15328416
申请日:2016-12-23
Inventor: Fan Tang
Abstract: The present application discloses a fabricating method for a thin film transistor, including steps of: S1, filling filling materials into the pores of the porous substrate to obtain a carrier substrate; S2, fabricating a flexible film layer on the carrier substrate; S3, removing the filler material; S4, fabricating an organic light emitting diode on the flexible film layer; and S5, removing the porous substrate to obtain the thin film transistor. The fabricating method of the thin film transistor according to the present application is based on a porous substrate having a microporous structure, due to the presence of microporous, the bubbles generated during the OLED fabricating process can be released to avoid the damage of the bubbles during the laser irradiation and to the deposition metal mask; and eliminating the process of removing the sacrificial layer by laser irradiation, and the heating the heating process in the conventional technology.
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公开(公告)号:US10224496B2
公开(公告)日:2019-03-05
申请号:US15510227
申请日:2016-11-18
Inventor: Fan Tang
Abstract: The present application provides an OLED package structure, comprises a package unit and a flexible substrate deposited with an OLED element; the package unit comprises a first package layer, a first inorganic layer and a second package layer, which sequentially stack up on the OLED element; the first package layer comprises a first pixel region and a first pixel define region, and the film thickness of the first pixel define region gradually decreases from an edge to an interior of the first pixel define region; the second package layer comprises a second pixel region corresponding to the first pixel region and a second pixel define region corresponding to the first pixel define region, and the film thickness of the second pixel region gradually decreases from an edge to an interior of the second pixel region. The present application further provides an OLED package method.
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公开(公告)号:US10366911B2
公开(公告)日:2019-07-30
申请号:US15504330
申请日:2016-12-26
Inventor: Fan Tang
IPC: H01L21/683 , C23C14/04 , H01L51/56 , B32B27/08 , B32B27/30 , B32B7/12 , H01L21/50 , H01L51/00 , C23C14/24
Abstract: A carrier substrate for carrying an OLED in manufacturing process is disclosed. The carrier substrate includes a substrate and an attracted layer disposed on a surface of the substrate, wherein the attracted layer includes a resin layer and multiple magnetic nanoparticles distributed in the resin layer. A manufacturing method for the same is also disclosed. When manufacturing an OLED, the attracted layer receives the attraction force provided by the attraction body so that the deformation of the substrate for carrying an OLED in manufacturing generating by drooping because of gravity force can be canceled out or decreased in order to avoid a shadow effect and a color mixing.
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