Invention Grant
- Patent Title: Porous substrate and fabricating method thereof, and a fabricating method for thin film transistor
-
Application No.: US15328416Application Date: 2016-12-23
-
Publication No.: US10361402B2Publication Date: 2019-07-23
- Inventor: Fan Tang
- Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Wuhan, Hubei
- Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Wuhan, Hubei
- Agent Andrew C. Cheng
- Priority: CN201611195243 20161212
- International Application: PCT/CN2016/111801 WO 20161223
- International Announcement: WO2018/112919 WO 20180628
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L51/56 ; H01L51/00 ; H01L27/32 ; H01L21/77 ; H01L29/66 ; H01L27/12

Abstract:
The present application discloses a fabricating method for a thin film transistor, including steps of: S1, filling filling materials into the pores of the porous substrate to obtain a carrier substrate; S2, fabricating a flexible film layer on the carrier substrate; S3, removing the filler material; S4, fabricating an organic light emitting diode on the flexible film layer; and S5, removing the porous substrate to obtain the thin film transistor. The fabricating method of the thin film transistor according to the present application is based on a porous substrate having a microporous structure, due to the presence of microporous, the bubbles generated during the OLED fabricating process can be released to avoid the damage of the bubbles during the laser irradiation and to the deposition metal mask; and eliminating the process of removing the sacrificial layer by laser irradiation, and the heating the heating process in the conventional technology.
Public/Granted literature
- US20180294442A1 A POROUS SUBSTRATE AND FABRICATING METHOD THEREOF, AND A FABRICATING METHOD FOR THIN FILM TRANSISTOR Public/Granted day:2018-10-11
Information query
IPC分类: