Performance optimization of power amplifier
    1.
    发明授权
    Performance optimization of power amplifier 有权
    功率放大器的性能优化

    公开(公告)号:US08427238B2

    公开(公告)日:2013-04-23

    申请号:US13155321

    申请日:2011-06-07

    IPC分类号: H03F3/04

    CPC分类号: H03F1/52 H03F1/56

    摘要: Aspects of embodiments according to the present invention are directed toward a circuitry and a method to accurately measure the junction temperature of power amplifier and uses the measurement to enable optimization of performance in the presence of a mismatched load via control of the power amplifier such that corrective action to mitigate effects of the mismatched load can be performed.

    摘要翻译: 根据本发明的实施例的方面涉及准确地测量功率放大器的结温度的电路和方法,并且使用该测量来通过功率放大器的控制在存在不匹配负载的情况下优化性能,使得校正 可以执行减轻不匹配负载的影响的动作。

    PERFORMANCE OPTIMIZATION OF POWER AMPLIFIER
    2.
    发明申请
    PERFORMANCE OPTIMIZATION OF POWER AMPLIFIER 有权
    功率放大器性能优化

    公开(公告)号:US20120313710A1

    公开(公告)日:2012-12-13

    申请号:US13155321

    申请日:2011-06-07

    IPC分类号: H03F1/30 H03F3/16

    CPC分类号: H03F1/52 H03F1/56

    摘要: Aspects of embodiments according to the present invention are directed toward a circuitry and a method to accurately measure the junction temperature of power amplifier and uses the measurement to enable optimization of performance in the presence of a mismatched load via control of the power amplifier such that corrective action to mitigate effects of the mismatched load can be performed.

    摘要翻译: 根据本发明的实施例的方面涉及准确地测量功率放大器的结温度的电路和方法,并且使用该测量来通过功率放大器的控制在存在不匹配负载的情况下优化性能,使得校正 可以执行减轻不匹配负载的影响的动作。

    Multi-orientation phased antenna array and associated method
    3.
    发明授权
    Multi-orientation phased antenna array and associated method 有权
    多方向相控天线阵列及相关方法

    公开(公告)号:US08405548B2

    公开(公告)日:2013-03-26

    申请号:US12851174

    申请日:2010-08-05

    IPC分类号: H01Q3/02

    摘要: According to one embodiment, an antenna apparatus includes first and second antenna arrays configured in a support structure. Each antenna array has multiple antenna elements that transmit and/or receive electro-magnetic radiation. The elements of the first antenna array are oriented in a boresight direction that is different from the boresight direction in which the elements of the second antenna array are oriented. A plurality of switches alternatively couples the first antenna elements or the second antenna elements to a signal distribution circuit.

    摘要翻译: 根据一个实施例,天线装置包括配置在支撑结构中的第一和第二天线阵列。 每个天线阵列具有发射和/或接收电磁辐射的多个天线元件。 第一天线阵列的元件在与第二天线阵列的元件定向的视轴方向不同的视轴方向上定向。 多个开关交替地将第一天线元件或第二天线元件耦合到信号分配电路。

    Multi-band electronically scanned array antenna
    4.
    发明授权
    Multi-band electronically scanned array antenna 有权
    多频带电子扫描阵列天线

    公开(公告)号:US08570237B2

    公开(公告)日:2013-10-29

    申请号:US13019108

    申请日:2011-02-01

    IPC分类号: H01Q3/24

    CPC分类号: H01Q21/0025 H01Q5/42

    摘要: A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

    摘要翻译: 一种多频带电子扫描阵列天线,包括具有用于第一频带的电子电路的第一子组件; 机械地耦合到第一子组件并且具有用于第二频带的电子电路的第二子组件; 以及与所述第一子组件相邻的孔,所述孔由所述第一子组件和所述第二子组件共享。 阵列天线还可以包括频带切换电路或用于将第一子组件或第二子组件耦合到孔的组合电路。 阵列天线还可以包括第三子组件,其包括用于第三频带的电子电路。 以这种方式,孔由第一子组件,第二子组件和第三子组件共享以提供更小和更轻的阵列天线。

    MULTI-BAND ELECTRONICALLY SCANNED ARRAY ANTENNA
    5.
    发明申请
    MULTI-BAND ELECTRONICALLY SCANNED ARRAY ANTENNA 有权
    多带电子扫描阵列天线

    公开(公告)号:US20120194406A1

    公开(公告)日:2012-08-02

    申请号:US13019108

    申请日:2011-02-01

    IPC分类号: H01Q5/00 H01Q9/04 H01Q3/24

    CPC分类号: H01Q21/0025 H01Q5/42

    摘要: A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

    摘要翻译: 一种多频带电子扫描阵列天线,包括具有用于第一频带的电子电路的第一子组件; 机械地耦合到第一子组件并且具有用于第二频带的电子电路的第二子组件; 以及与所述第一子组件相邻的孔,所述孔由所述第一子组件和所述第二子组件共享。 阵列天线还可以包括频带切换电路或用于将第一子组件或第二子组件耦合到孔的组合电路。 阵列天线还可以包括第三子组件,其包括用于第三频带的电子电路。 以这种方式,孔由第一子组件,第二子组件和第三子组件共享以提供更小和更轻的阵列天线。

    Thermal management system and method for thin membrane type antennas
    7.
    发明授权
    Thermal management system and method for thin membrane type antennas 有权
    薄膜型天线热管理系统及方法

    公开(公告)号:US07983042B2

    公开(公告)日:2011-07-19

    申请号:US10869183

    申请日:2004-06-15

    申请人: James S. Wilson

    发明人: James S. Wilson

    摘要: According to an embodiment of the present invention, a thermal management system for electronic components includes a plurality of spacers disposed between a first flexible substrate and a second flexible substrate to form a plurality of heat transfer regions each having a plurality of capillary pumping regions, a two-phase fluid disposed between at least one pair of adjacent spacers, and a plurality of electronic components coupled to a mounting surface of the first flexible substrate.

    摘要翻译: 根据本发明的实施例,用于电子部件的热管理系统包括设置在第一柔性基板和第二柔性基板之间的多个间隔件,以形成多个传热区域,每个传热区域具有多个毛细管抽吸区域, 设置在至少一对相邻间隔件之间的两相流体和耦合到第一柔性基板的安装表面的多个电子部件。

    Air Cooling for a Phased Array Radar
    8.
    发明申请
    Air Cooling for a Phased Array Radar 有权
    相控阵雷达的空气冷却

    公开(公告)号:US20100157531A1

    公开(公告)日:2010-06-24

    申请号:US12340171

    申请日:2008-12-19

    IPC分类号: H05K7/20

    CPC分类号: H01Q1/02 H01Q3/26 H05K7/20163

    摘要: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

    摘要翻译: 在某些实施例中,用于电子部件的结构包括具有基本上平面形状的基板。 底板限定了允许空气流动的一个或多个开口。 该结构包括耦合到基板的框架。 框架包括具有基本上平行于基板的基本上平面形状的平面支撑件。 然后,平面支撑件和底板至少部分地限定一个或多个增压室。 平面支撑件还被配置为支持一个或多个发射/接收集成微波模块。 框架还包括限定用于空气流动的一个或多个通道的多个框架支撑件。 每个通道对应于其中一个增压室。 此外,框架包括具有限定多个空气入口的表面的通风面板。 空气入口允许空气进入一个或多个增压室中的一个。 此外,框架包括被配置为散热的一个或多个热接口。

    Method and apparatus for temperature gradient control in an electronic system
    9.
    发明授权
    Method and apparatus for temperature gradient control in an electronic system 有权
    电子系统中温度梯度控制的方法和装置

    公开(公告)号:US07017651B1

    公开(公告)日:2006-03-28

    申请号:US09660733

    申请日:2000-09-13

    IPC分类号: F28F13/12

    摘要: An apparatus includes a plurality of Transmit/Receive (T/R) modules (20) coupled with a slat assembly (34). The slat assembly includes a fluid passageway (54). A plurality of turbulence inducing structures (62, 162, 262, 104, 204, 304, 462) are disposed within the fluid passageway. In one embodiment, the turbulence inducing structures includes constrictions (62) extending from a surface (55) of the fluid passageway. The location and configuration of the structures is selected to achieve a predetermined temperature profile along the passageway, in response to fluid flow through the fluid passageway.

    摘要翻译: 一种装置包括与板条组件(34)连接的多个发送/接收(T / R)模块(20)。 板条组件包括流体通道(54)。 多个湍流诱导结构(62,162,262,104,204,304,462)设置在流体通道内。 在一个实施例中,湍流诱导结构包括从流体通道的表面(55)延伸的收缩部(62)。 选择结构的位置和构造以响应于流过流体通道的流体流动而沿着通道实现预定的温度分布。

    Air cooling for a phased array radar
    10.
    发明授权
    Air cooling for a phased array radar 有权
    相控阵雷达的空气冷却

    公开(公告)号:US07898810B2

    公开(公告)日:2011-03-01

    申请号:US12340171

    申请日:2008-12-19

    IPC分类号: H05K7/20

    CPC分类号: H01Q1/02 H01Q3/26 H05K7/20163

    摘要: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

    摘要翻译: 在某些实施例中,用于电子部件的结构包括具有基本上平面形状的基板。 底板限定了允许空气流动的一个或多个开口。 该结构包括耦合到基板的框架。 框架包括具有基本上平行于基板的基本上平面形状的平面支撑件。 然后,平面支撑件和底板至少部分地限定一个或多个增压室。 平面支撑件还被配置为支持一个或多个发射/接收集成微波模块。 框架还包括限定用于空气流动的一个或多个通道的多个框架支撑件。 每个通道对应于其中一个增压室。 此外,框架包括具有限定多个空气入口的表面的通风面板。 空气入口允许空气进入一个或多个增压室中的一个。 此外,框架包括被配置为散热的一个或多个热接口。