HEAT SINK
    1.
    发明申请
    HEAT SINK 失效
    散热器

    公开(公告)号:US20070107871A1

    公开(公告)日:2007-05-17

    申请号:US11308862

    申请日:2006-05-16

    IPC分类号: H05K7/20

    摘要: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

    摘要翻译: 用于从电子部件散热的散热器包括散热器和设置在其上的多个第一散热片和第二散热片。 第一和第二散热片彼此平行并且以交替的顺序布置以便限定多个空气通道。 第一和第二散热片设置成使得沿着空气通道的延伸方向在中间更薄的空气通道和更密集的翅片分布,并且提供了更宽的空气通道,并且在两端具有较低的翅片分布密度。

    HEAT DISSIPATION DEVICE
    2.
    发明申请
    HEAT DISSIPATION DEVICE 失效
    散热装置

    公开(公告)号:US20080121371A1

    公开(公告)日:2008-05-29

    申请号:US11626716

    申请日:2007-01-24

    IPC分类号: F28D15/00 H05K7/20

    摘要: A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.

    摘要翻译: 散热装置包括:底座,其包括由第一导热材料制成的基板和由导热率低于第一导热材料的第二导热材料制成的基板。 衬底包括具有窗口的框架,窗口在其中容纳基板,并且跨越窗口的接合板。 翅片组包括彼此平行并间隔开的多个翅片,并且安装在基座上。 热管具有夹在基板和接合板之间的蒸发部分,以及延伸穿过翅片组并与其热连接的两个冷凝部分。 蒸发部分具有大致V形的构造。