公开(公告)号：US20080121371A1

公开(公告)日：2008-05-29

申请号：US11626716

申请日：2007-01-24

申请人： ZHI-YONG ZHOU ,  MIN-QI XIAO ,  ZENG-JUN GAO

发明人： ZHI-YONG ZHOU ,  MIN-QI XIAO ,  ZENG-JUN GAO

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H01L23/467 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base including a base plate made of a first heat conductive material and a substrate made of a second heat conductive material having a heat conductivity lower than that of the first heat conductive material. The substrate comprises a frame with a window receiving the base plate therein and an engaging plate spanning over the window. A fin set includes a plurality of fins parallel with and spaced from each other, and is mounted on the base. A heat pipe has an evaporating section sandwiched between the base plate and the engaging plate, and two condensing sections extending through the fin set and thermally connecting therewith. The evaporating section has a substantially V-shaped configuration.

摘要翻译： 散热装置包括：底座，其包括由第一导热材料制成的基板和由导热率低于第一导热材料的第二导热材料制成的基板。 衬底包括具有窗口的框架，窗口在其中容纳基板，并且跨越窗口的接合板。 翅片组包括彼此平行并间隔开的多个翅片，并且安装在基座上。 热管具有夹在基板和接合板之间的蒸发部分，以及延伸穿过翅片组并与其热连接的两个冷凝部分。 蒸发部分具有大致V形的构造。