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公开(公告)号:US10249661B2
公开(公告)日:2019-04-02
申请号:US14466412
申请日:2014-08-22
Applicant: VisEra Technologies Company Limited
Inventor: Ho-Tai Lin
IPC: G02B3/00 , G02B5/20 , H01L27/146
Abstract: An imaging device is provided. The imaging device includes a plurality of photoelectric conversion elements formed on a substrate in an active area. A microlens structure is disposed above the photoelectric conversion elements. A dummy pattern having a plurality of protruding elements is disposed above the substrate in a peripheral area surrounding the active area. Furthermore, a passivation film is conformally formed on the microlens structure and the dummy pattern. The passivation film on the tops of the protruding elements of the dummy pattern has a surface area smaller than a surface area of the peripheral area outside of the microlens structure.
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公开(公告)号:US11988855B2
公开(公告)日:2024-05-21
申请号:US16451130
申请日:2019-06-25
Applicant: VisEra Technologies Company Limited
Inventor: Ho-Tai Lin , Shin-Hong Chen
CPC classification number: G02B5/201 , G06V40/1318 , G06V40/1394 , G02B5/20
Abstract: An optical fingerprint sensor is provided. The optical fingerprint sensor includes a substrate, a light-shielding layer and an optical material layer. The light-shielding layer is disposed on the substrate. The optical material layer is in contact with the light-shielding layer. The optical material layer includes a non-filtering portion and a filtering portion.
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公开(公告)号:US10770496B2
公开(公告)日:2020-09-08
申请号:US15953837
申请日:2018-04-16
Applicant: VisEra Technologies Company Limited
Inventor: Ching-Chiang Wu , Ho-Tai Lin , Masafumi Sano
IPC: H01L27/146
Abstract: An optical sensor includes an optical layer disposed on a substrate, and a light shielding layer disposed on the optical layer, wherein the light shielding layer includes a first opening that partially exposes the optical layer. The optical sensor also includes a polymer material layer that fills the first opening, wherein a top surface of the polymer material layer is higher than a top surface of the light shielding layer. The optical sensor further includes an adhesive layer disposed on the light shielding layer and the polymer material layer, and a surface component disposed on the adhesive layer.
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