公开(公告)号：US10414685B2

公开(公告)日：2019-09-17

申请号：US15793754

申请日：2017-10-25

申请人： Via Mechanics, Ltd.

发明人： Kenichi Ichikawa ,  Kaori Tateishi ,  Yasushi Ito

IPC分类号： G01B11/26 ,  C03B33/10 ,  B25H7/04 ,  B23K26/00 ,  B23K26/035 ,  B23K26/352 ,  B23K26/402 ,  B23K26/382 ,  C03C17/32 ,  C03C19/00 ,  B23K103/00 ,  C03B33/037 ,  C03B33/07 ,  B23K103/16

摘要： In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

公开(公告)号：US11712757B2

公开(公告)日：2023-08-01

申请号：US15956094

申请日：2018-04-18

申请人： Via Mechanics, Ltd.

发明人： Kaori Tateishi ,  Yasushi Ito

IPC分类号： B23K26/386 ,  B23K26/40 ,  C03C15/00 ,  C03C23/00 ,  B23K26/18 ,  B23K26/384 ,  B23K26/0622 ,  B23K26/402 ,  B23K26/382 ,  B23K103/00

CPC分类号： B23K26/386 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  C03C15/00 ,  C03C23/0025 ,  B23K2103/54

摘要： Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.