公开(公告)号：US11936124B2

公开(公告)日：2024-03-19

申请号：US17261086

申请日：2019-07-31

申请人： VIASAT, INC.

发明人： Douglas J. Mathews ,  David C. Wittwer ,  James F. Landers

IPC分类号： H01Q1/22 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q21/06

CPC分类号： H01Q9/0457 ,  H01Q1/2283 ,  H01Q21/0025 ,  H01Q21/065

摘要： An antenna element can include a feed and a radiating element and a dielectric substrate having a first surface and a second surface, the dielectric substrate comprising the feed of the antenna element within the dielectric substrate. The antenna element module can also include an integrated circuit (IC) chip adhered to the first surface the dielectric substrate and coupled to the feed of the antenna element. The IC chip can include a circuit to adjust a signal communicated with the feed. The antenna element module can further include a plastic antenna carrier adhered to the second surface of the dielectric substrate. The plastic antenna carrier can include a body portion comprising a cavity for the radiating element of the antenna element, the radiating element positioned in the cavity of the body portion of the plastic antenna carrier.

公开(公告)号：US20240347917A1

公开(公告)日：2024-10-17

申请号：US18441439

申请日：2024-02-14

申请人： VIASAT, INC.

发明人： Douglas J. Mathews ,  David C. Wittwer ,  James F. Landers

IPC分类号： H01Q9/04 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q21/06

CPC分类号： H01Q9/0457 ,  H01Q1/2283 ,  H01Q21/0025 ,  H01Q21/065

摘要： An antenna element can include a feed and a radiating element and a dielectric substrate having a first surface and a second surface, the dielectric substrate comprising the feed of the antenna element within the dielectric substrate. The antenna element module can also include an integrated circuit (IC) chip adhered to the first surface the dielectric substrate and coupled to the feed of the antenna element. The IC chip can include a circuit to adjust a signal communicated with the feed. The antenna element module can further include a plastic antenna carrier adhered to the second surface of the dielectric substrate. The plastic antenna carrier can include a body portion comprising a cavity for the radiating element of the antenna element, the radiating element positioned in the cavity of the body portion of the plastic antenna carrier.

公开(公告)号：US11038281B2

公开(公告)日：2021-06-15

申请号：US16460641

申请日：2019-07-02

申请人： VIASAT, INC.

发明人： Steven J. Franson ,  Douglas J. Mathews

IPC分类号： H01Q21/22 ,  H01Q1/38 ,  H01Q1/02 ,  H01Q21/00 ,  H01Q1/48 ,  H01Q3/38

摘要： Disclosed is an antenna apparatus including a first subassembly having a plurality of antenna elements, and a second subassembly adhered to the first subassembly. The second subassembly may include a plurality of components of a beamforming network encapsulated within a molding material. One or more interconnect layers may be disposed on the molding material to electrically couple the plurality of components of the beamforming network to the plurality of antenna elements. Methods of fabricating the antenna apparatus are also disclosed.

公开(公告)号：US10944180B2

公开(公告)日：2021-03-09

申请号：US15962294

申请日：2018-04-25

申请人： ViaSat, Inc.

发明人： Maria Carolina Vigano ,  Kenneth V. Buer ,  Douglas J. Mathews

IPC分类号： H01Q3/26 ,  H01Q21/00 ,  H01Q1/22 ,  H01Q3/40 ,  H01Q21/06 ,  H01Q1/38

摘要： A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

公开(公告)号：US20210050312A1

公开(公告)日：2021-02-18

申请号：US16538197

申请日：2019-08-12

申请人： VIASAT, INC.

发明人： Steven J. Franson ,  Douglas J. Mathews

IPC分类号： H01L23/66 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/538 ,  H01L23/498

摘要： Disclosed is an antenna apparatus including a substrate having a cavity in a first outer surface thereof. The substrate has a sidewall defining a portion of the cavity, and a first edge contact is formed at the sidewall. An IC chip is disposed within the cavity and has a side surface facing the sidewall and a second edge contact formed on the side surface electrically connected to the first edge contact. An antenna element, disposed at a second outer surface of the substrate opposite the first outer surface, is electrically connected to RF circuitry within the IC chip through a conductive via extending within the substrate.

公开(公告)号：US11967937B2

公开(公告)日：2024-04-23

申请号：US16959973

申请日：2019-01-17

申请人： VIASAT, INC.

发明人： Shih Peng Sun ,  Kenneth V. Buer ,  Michael R. Lyons ,  Gary P. English ,  Qiang R. Chen ,  Ramanamurthy V. Darapu ,  Douglas J. Mathews ,  Mark S. Berkheimer ,  Brandon C. Drake

IPC分类号： H03F3/213 ,  H01L21/48 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H01L23/66 ,  H03F1/56 ,  H05K1/18

CPC分类号： H03F3/213 ,  H01L21/4853 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L23/66 ,  H01L24/48 ,  H03F1/56 ,  H05K1/181 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2224/48139 ,  H03F2200/451

摘要： A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.

公开(公告)号：US11757203B2

公开(公告)日：2023-09-12

申请号：US17318559

申请日：2021-05-12

申请人： VIASAT, INC.

发明人： Steven J. Franson ,  Douglas J. Mathews

IPC分类号： H01Q21/00 ,  H01Q21/22 ,  H01Q1/02 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/38

CPC分类号： H01Q21/0025 ,  H01Q1/02 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/38 ,  H01Q21/00 ,  H01Q21/0087 ,  H01Q21/22

摘要： Disclosed is an antenna apparatus including a first subassembly having a plurality of antenna elements, and a second subassembly adhered to the first subassembly. The second subassembly may include a plurality of components of a beamforming network encapsulated within a molding material. One or more interconnect layers may be disposed on the molding material to electrically couple the plurality of components of the beamforming network to the plurality of antenna elements. Methods of fabricating the antenna apparatus are also disclosed.

公开(公告)号：US11482791B2

公开(公告)日：2022-10-25

申请号：US17164396

申请日：2021-02-01

申请人： ViaSat, Inc.

发明人： Maria Carolina Vigano ,  Kenneth V. Buer ,  Douglas J. Mathews

IPC分类号： H01Q21/00 ,  H01Q3/26 ,  H01Q1/22 ,  H01Q3/40 ,  H01Q21/06 ,  H01Q1/38

摘要： A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.

公开(公告)号：US12080661B2

公开(公告)日：2024-09-03

申请号：US17372797

申请日：2021-07-12

申请人： VIASAT, INC.

发明人： Steven J. Franson ,  Douglas J. Mathews

IPC分类号： H01L23/66 ,  H01L21/50 ,  H01L23/498 ,  H01L23/538 ,  H01Q1/22 ,  H01Q1/38 ,  H01L21/60

CPC分类号： H01L23/66 ,  H01L21/50 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01Q1/2283 ,  H01Q1/38 ,  H01L21/60 ,  H01L2021/60285 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677

摘要： Disclosed is an antenna apparatus including a substrate having a cavity in a first outer surface thereof. The substrate has a sidewall defining a portion of the cavity, and a first edge contact is formed at the sidewall. An IC chip is disposed within the cavity and has a side surface facing the sidewall and a second edge contact formed on the side surface electrically connected to the first edge contact. An antenna element, disposed at a second outer surface of the substrate opposite the first outer surface, is electrically connected to RF circuitry within the IC chip through a conductive via extending within the substrate.

公开(公告)号：US20220005770A1

公开(公告)日：2022-01-06

申请号：US17372797

申请日：2021-07-12

申请人： VIASAT, INC.

发明人： STEVEN J. FRANSON ,  Douglas J. Mathews

IPC分类号： H01L23/66 ,  H01L21/50 ,  H01L23/498 ,  H01L23/538 ,  H01Q1/22 ,  H01Q1/38

摘要： Disclosed is an antenna apparatus including a substrate having a cavity in a first outer surface thereof. The substrate has a sidewall defining a portion of the cavity, and a first edge contact is formed at the sidewall. An IC chip is disposed within the cavity and has a side surface facing the sidewall and a second edge contact formed on the side surface electrically connected to the first edge contact. An antenna element, disposed at a second outer surface of the substrate opposite the first outer surface, is electrically connected to RF circuitry within the IC chip through a conductive via extending within the substrate.