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    Methods for vapor deposition
    1.
    发明授权
    Methods for vapor deposition 有权

    公开(公告)号：US10661297B2

    公开(公告)日：2020-05-26

    申请号：US16032803

    申请日：2018-07-11

    Applicant: United Technologies Corporation

    Inventor： James W. Neal ,  Kevin W. Schlichting ,  Brian T. Hazel ,  David A. Litton ,  Eric Jorzik ,  Michael J. Maloney

    IPC: C23C14/24 ,  B05B15/62 ,  C23C14/50

    Abstract: An embodiment of a method includes retaining a first workpiece and a second workpiece selectively on a workpiece fixture disposed within a deposition chamber. The workpiece fixture includes tooling including a first workpiece holder, a second workpiece holder, and a first hollow wall. The first workpiece is separated from the second workpiece using the first hollow wall. Energy is selectively applied and directed within the deposition chamber, from an energy source toward a first crucible, the first crucible including a plurality of walls defining an upper recess contiguous with, and disposed directly above a first lower recess, at least the upper recess open to an interior of the deposition chamber. During the step of selectively applying and directing energy, a gas valve is controlled to maintain a partial vacuum in the deposition chamber of greater than 2 Pa to control a size and overlap of at least one coating zone formed around each of the at least one workpiece.

    Deposition Apparatus and Methods
    4.
    发明申请
    Deposition Apparatus and Methods 审中-公开
    沉积设备和方法

    公开(公告)号：US20160060748A1

    公开(公告)日：2016-03-03

    申请号：US14774489

    申请日：2014-03-14

    Applicant: UNITED TECHNOLOGIES CORPORATION

    Inventor： Brian T. Hazel ,  Michael J. Maloney ,  James W. Neal ,  David A. Litton

    IPC: C23C14/30 ,  C23C14/24

    CPC classification number: C23C14/30 ,  C23C14/228 ,  C23C14/243 ,  C23C14/246 ,  C23C14/505

    Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

    Abstract translation: 一种沉积设备（20），包括：腔室（22）; 耦合到所述室的处理气体源（62）; 耦合到所述室的真空泵（52）; 至少两个电子枪（26）; 耦合到电子枪的一个或多个电源（30）; 多个坩埚（32,33,34），其定位或定位在至少一个所述电子枪的视野内的操作位置; 以及具有至少一个操作位置的部件保持器（170），用于将间隔在坩埚上方的部件保持在间隔高度H上。间隔高度H在包括至少22英寸的范围内是可调节的。

    Deposition apparatus and methods
    7.
    发明授权
    Deposition apparatus and methods 有权

    公开(公告)号：US11365473B2

    公开(公告)日：2022-06-21

    申请号：US16527250

    申请日：2019-07-31

    Applicant: United Technologies Corporation

    Inventor： Brian T. Hazel ,  Michael J. Maloney ,  James W. Neal ,  David A. Litton

    IPC: C23C14/30 ,  C23C14/24 ,  C23C14/22 ,  C23C14/50

    Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

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