公开(公告)号：US11155903B2

公开(公告)日：2021-10-26

申请号：US16786845

申请日：2020-02-10

申请人： UT-Battelle, LLC

发明人： Alexander Plotkowski ,  Ryan Dehoff ,  Frederick List, III ,  Jason Pries ,  Benjamin Stump ,  Keith Carver ,  Peeyush Nandwana

IPC分类号： B33Y80/00 ,  C22C38/02 ,  B33Y10/00 ,  B33Y70/00 ,  C22C38/00 ,  B23K26/34 ,  B23K26/354

摘要： Disclosed herein are embodiments of soft magnetic alloy embodiments for use in additive manufacturing and structures fabricated from such alloys. In some embodiments, the fabricated structures comprise a continuous thin wall (or plurality thereof) having a geometry that promotes reduced eddy current losses and other performance enhancements. In some embodiments, the fabricated structures are used to make components, such as transformer cores and/or electric motors.