公开(公告)号：US20150294058A1

公开(公告)日：2015-10-15

申请号：US14278296

申请日：2014-05-15

Applicant: United Microelectronics Corp.

Inventor： En-Chiuan Liou ,  Yu-Ying Huang ,  Jen-Hsiu Li ,  Mei-Chen Chen ,  Ya-Ling Chen ,  Yi-Jing Wang ,  Chi-Ming Huang

IPC: G06F17/50 ,  H01L21/033

CPC classification number: H01L21/0334 ,  H01L21/0337 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.

Abstract translation: 在本公开中，提供了一种标记分割方法及其制造应用该半导体结构的方法。 标记分割方法包括以下步骤。 首先，通过处理器识别具有宽度WS并且由形成在基板上的空间SS彼此分离的多个段。 此后，处理器在片段上设置多个标记。 该步骤包括：（1）处理器调整每一个标记的宽度WM等于m（WS + SS）+ WS或m（WS + SS）+ SS，其中m是整数; 和（2）由处理器调整相邻两个标记的空格SM，使得WM + SM = n（WS + SS），其中n是整数。

公开(公告)号：US09373505B2

公开(公告)日：2016-06-21

申请号：US14278296

申请日：2014-05-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： En-Chiuan Liou ,  Yu-Ying Huang ,  Jen-Hsiu Li ,  Mei-Chen Chen ,  Ya-Ling Chen ,  Yi-Jing Wang ,  Chi-Ming Huang

IPC: H01L23/544 ,  H01L21/033

CPC classification number: H01L21/0334 ,  H01L21/0337 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width WS and separated from each other by a space SS formed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width WM of each one of the marks being equal to m(WS+SS)+WS or m(WS+SS)+SS by the processor, wherein m is an integer; and (2) adjusting a space SM of adjacent two of the marks by the processor such that WM+SM=n(WS+SS), wherein n is an integer.

Abstract translation: 在本公开中，提供了一种标记分割方法及其制造应用该半导体结构的方法。 标记分割方法包括以下步骤。 首先，通过处理器识别具有宽度WS并且由形成在基板上的空间SS彼此分离的多个段。 此后，处理器在片段上设置多个标记。 该步骤包括：（1）处理器调整每一个标记的宽度WM等于m（WS + SS）+ WS或m（WS + SS）+ SS，其中m是整数; 和（2）由处理器调整相邻两个标记的空格SM，使得WM + SM = n（WS + SS），其中n是整数。