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1.发明申请Inter-transmission multi memory chip, system including the same and associated method 有权传输多内存芯片，系统包括相同和相关的方法公开(公告)号：US20080205113A1
公开(公告)日：2008-08-28
申请号：US12071745
申请日：2008-02-26
Applicant: UK-song Kang , Jung-bae Lee
Inventor： UK-song Kang , Jung-bae Lee
IPC: G11C5/06
Abstract: A multi memory chip stacked on a multi core CPU includes a plurality of memories, each memory corresponding to a CPU core from among the CPU cores and being configured to directly transmit data between the other memories of the multi memory chip.
Abstract translation: 堆叠在多核CPU上的多存储器芯片包括多个存储器，每个存储器对应于CPU核心中的CPU核心，并且被配置为直接在多存储器芯片的其他存储器之间传输数据。
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