公开(公告)号：US20080023834A1

公开(公告)日：2008-01-31

申请号：US11867527

申请日：2007-10-04

申请人： Tz-Cheng Chiu ,  Manjula Variyam

发明人： Tz-Cheng Chiu ,  Manjula Variyam

IPC分类号： H01L23/488

CPC分类号： H05K3/4007 ,  H01L2224/05557 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0367 ,  H05K2201/099 ,  H05K2201/09909 ,  H01L2924/00

摘要： A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

摘要翻译： 一种凸起的焊接掩模限定（SMD）焊盘，其被配置为在叠层电子电路板上接收焊球，以及在叠层电子电路板上形成升高的SMD焊盘的方法。 该方法可以包括形成基底凸起，用导电凸起层覆盖基底凸起并且在导电凸块层的延伸边缘上层叠围绕材料。 将周围材料图案化以暴露出导电凸块层的焊盘面和侧面的一部分，使得焊盘面设置在周围材料的表面上方。 周围的材料可以通过光刻操作或者激光钻孔操作来构图。

公开(公告)号：US20050106505A1

公开(公告)日：2005-05-19

申请号：US10715641

申请日：2003-11-18

申请人： Tz-Cheng Chiu ,  Manjula Variyam

发明人： Tz-Cheng Chiu ,  Manjula Variyam

IPC分类号： G03F7/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/4007 ,  H01L2224/05557 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0367 ,  H05K2201/099 ,  H05K2201/09909 ,  H01L2924/00

摘要： A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

摘要翻译： 一种凸起的焊接掩模限定（SMD）焊盘，其被配置为在叠层电子电路板上接收焊球，以及在叠层电子电路板上形成升高的SMD焊盘的方法。 该方法可以包括形成基底凸起，用导电凸起层覆盖基底凸起并且在导电凸块层的延伸边缘上层叠围绕材料。 将周围材料图案化以暴露出导电凸块层的焊盘面和侧面的一部分，使得焊盘面设置在周围材料的表面上方。 周围的材料可以通过光刻操作或者激光钻孔操作来构图。

公开(公告)号：US20050133566A1

公开(公告)日：2005-06-23

申请号：US10745358

申请日：2003-12-23

申请人： Manjula Variyam

发明人： Manjula Variyam

IPC分类号： B23K20/00 ,  G06F9/45 ,  G06F17/50 ,  H01L21/60

CPC分类号： B23K20/007 ,  G06F17/5018 ,  G06F2217/36 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48451 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78306 ,  H01L2224/78307 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/20103 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention may provide ways and uses for correlating actual wire bonding machine adjustment parameters to inputs needed for FEA simulations in modeling actual wire bonding operations of a specified capillary design and wire bonding machine. Simulations of wire bonding operations using the specified capillary design are performed with a range of inputs (e.g., capillary displacement, wire yield strength) to develop empirical equations relating to the simulations. Actual wire bonding operations are performed using the specified capillary design with ranges of the actual wire bonding machine adjustment parameters, and the results provide empirical equations relating to the actual wire bonding machine adjustment parameters. The empirical equations are combined to provide empirical equations for the simulation inputs as functions of the actual wire bonding machine adjustment parameters. Such equations may aid in performing chip failure analysis and/or may be incorporated into design rules.

摘要翻译： 本发明的实施例可以提供用于将实际引线接合机调节参数与用于对特定毛细管设计和引线接合机的实际引线接合操作建模的FEA模拟所需的输入相关联的方式和用途。 使用特定毛细管设计的引线接合操作的模拟通过一系列输入（例如，毛细管位移，导线屈服强度）进行，以开发与仿真有关的经验方程。 使用指定的毛细管设计进行实际引线接合操作，其范围为实际引线接合机器调整参数，结果提供与实际接线机调整参数有关的经验方程。 将经验方程组合起来，为模拟输入提供经验方程，作为实际线焊机调整参数的函数。 这样的方程式可以有助于执行芯片故障分析和/或可以并入设计规则。