RECESSED OHMIC CONTACTS IN A III-N DEVICE
    2.
    发明申请
    RECESSED OHMIC CONTACTS IN A III-N DEVICE 有权
    在III-N设备中的接触的OHMIC联系

    公开(公告)号:US20160172455A1

    公开(公告)日:2016-06-16

    申请号:US14572670

    申请日:2014-12-16

    申请人: Transphorm Inc.

    摘要: A device includes a III-N layer having an upper side and a lower side, the lower side being opposite the upper side, and at least one conductive contact on the upper side of the III-N layer, the conductive contact extending into the III-N layer. The conductive contact comprises a top side facing away from the lower side of the III-N layer, and a bottom side facing towards the lower side of the III-N layer. The bottom side includes a first end and a second end opposite the first end, a first side rising from the first end to an intermediate point closer to the top side than the first end, and a second side falling from the intermediate point to the second end further from the top side than the intermediate point.

    摘要翻译: 一种器件包括具有上侧和下侧的III-N层,下侧与上侧相对,以及在III-N层的上侧上的至少一个导电接触,导电接触延伸到III -N层。 导电接触包括背离III-N层的下侧的顶面和面向III-N层的下侧的底侧。 底侧包括与第一端相对的第一端和第二端,第一侧从第一端起升到比第一端更靠近顶侧的中间点,以及从中间点到第二侧的第二侧 从顶侧到中间点为止。