公开(公告)号：US10312197B2

公开(公告)日：2019-06-04

申请号：US14475326

申请日：2014-09-02

申请人： Toshiba Memory Corporation

发明人： Yuusuke Takano ,  Takashi Imoto ,  Takeshi Watanabe ,  Soichi Homma ,  Katsunori Shibuya

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

摘要： According to one embodiment, a method of manufacturing a semiconductor device includes forming a sealing resin layer containing an inorganic filler so as to seal a semiconductor chip, removing a portion of the surface of the sealing resin layer by dry etching such that a portion of the inorganic filler is exposed, and forming a shield layer so as to cover at least the sealing resin layer.

公开(公告)号：US09824905B2

公开(公告)日：2017-11-21

申请号：US14482489

申请日：2014-09-10

申请人： Toshiba Memory Corporation

发明人： Katsunori Shibuya ,  Takashi Imoto ,  Soichi Homma ,  Takeshi Watanabe ,  Yuusuke Takano

IPC分类号： G01R31/10 ,  H01L21/67 ,  C23C14/54 ,  H01L23/552 ,  C23C14/56

CPC分类号： H01L21/67265 ,  C23C14/54 ,  C23C14/56 ,  H01L21/67259 ,  H01L21/67288 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/00

摘要： A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover.

公开(公告)号：US11715701B2

公开(公告)日：2023-08-01

申请号：US16386774

申请日：2019-04-17

申请人： Toshiba Memory Corporation

发明人： Yuusuke Takano ,  Yoshiaki Goto ,  Takeshi Watanabe ,  Takashi Imoto

IPC分类号： H01L23/552 ,  H01L21/66 ,  H01L23/00 ,  H01L23/31 ,  G01R31/28

CPC分类号： H01L23/552 ,  H01L22/14 ,  H01L24/48 ,  H01L24/49 ,  G01R31/2853 ,  H01L23/3128 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2924/181 ,  H01L2924/00012

摘要： According to one embodiment, a semiconductor device includes a wiring board that has a first surface and a second surface opposed to the first surface, a semiconductor chip provided on the first surface, external connection terminals provided on the second surface, a sealing resin layer provided on the first surface, and a conductive shield layer that covers at least a portion of a side surface of the wiring board and the sealing resin layer. The wiring board includes a first ground wire that is electrically connected to the conductive shield layer, and a second ground wire that is electrically connected to the conductive shield layer and is electrically insulated from the first ground wire.