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公开(公告)号：US20150044610A1
公开(公告)日：2015-02-12
申请号：US14374407
申请日：2013-01-24
Applicant: Toray Industries, Inc.
Inventor： Satoshi Matsuba , Tsukuru Mizuguchi , Kazutaka Kusano
CPC classification number: G03F7/038 , C09D5/24 , G03F7/004 , G03F7/0047 , G03F7/0388 , G03F7/168 , H01B1/22 , H05K1/095 , H05K3/02 , H05K2203/0514
Abstract: A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitive component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.
Abstract translation: 光敏导电膏提供具有良好储存稳定性的涂膜，能够在相对低温固化条件下保持高粘合性，并且还能够表现出高导电性。 感光性导电糊包含（A）导电性粒子，（B）感光性成分，（C）光聚合引发剂和（D）环氧树脂，其中环氧树脂（D）的环氧当量为200〜500g / 当量。
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公开(公告)号：US09846362B2
公开(公告)日：2017-12-19
申请号：US14766149
申请日：2014-03-13
Applicant: Toray Industries, Inc.
Inventor： Tsukuru Mizuguchi , Takuya Nakayama , Kazutaka Kusano
CPC classification number: G03F7/0388 , G03F7/0047 , G03F7/168 , G03F7/20 , G03F7/32 , G03F7/40 , G06F3/044 , H01B1/22
Abstract: A conductive paste can form a minute conductive pattern having markedly high adhesion and exhibiting conductivity at relatively low temperatures. The conductive paste contains: a compound (A) having a primary amino group, a secondary amino group, and a tertiary amino group; a compound (B) having a carboxyl group; and a conductive filler (C).
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公开(公告)号：US20140360763A1
公开(公告)日：2014-12-11
申请号：US14372566
申请日：2013-01-10
Applicant: Toray Industries, Inc.
Inventor： Tsukuru Mizuguchi , Kazutaka Kusano
CPC classification number: H01B1/22 , C09D7/40 , C09D11/037 , C09D11/52 , C09D201/02 , C09D201/08 , G03F7/0047 , G03F7/027 , G03F7/038 , G03F7/40 , G06F3/041 , G06F2203/04103 , H01B1/20 , H05K1/0274 , H05K1/092 , H05K3/02 , H05K2201/0218 , H05K2201/0221 , H05K2201/0326 , H05K2203/0514
Abstract: A conductive paste includes: composite particles (A) formed by coating a surface of a core material composed of an inorganic material with an antimony-containing compound; a compound (B) having an acid value of 30 to 250 mg KOH/g; and a conductive filler (C).
Abstract translation: 导电糊包括：通过用含锑化合物涂覆由无机材料构成的芯材的表面形成的复合颗粒（A）; 酸值为30〜250mg KOH / g的化合物（B） 和导电填料（C）。
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公开(公告)号：US11449180B2
公开(公告)日：2022-09-20
申请号：US16481234
申请日：2018-02-16
Applicant: TORAY INDUSTRIES, INC.
Inventor： Kohei Takase , Tsukuru Mizuguchi
Abstract: The present invention provides a method for manufacturing a substrate equipped with a wiring electrode which has a fine pattern and is excellent in conductivity and in which an opaque wiring electrode is hardly visible. Disclosed is a method for manufacturing a substrate equipped with a wiring electrode including the steps of forming an opaque wiring electrode on at least one side of a transparent substrate, applying a positive photosensitive composition on one side of the transparent substrate, and exposing and developing the positive photosensitive composition using the opaque wiring electrode as a mask to form a functional layer at a portion corresponding to the opaque wiring electrode.
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公开(公告)号：US10275104B2
公开(公告)日：2019-04-30
申请号：US15788296
申请日：2017-10-19
Applicant: TORAY INDUSTRIES, INC.
Inventor： Tsukuru Mizuguchi , Tomotaka Kawano
Abstract: A laminate member is provided which has excellent ion migration resistance between a light-sensitive resin layer and a conductive layer formed on a substrate. This laminate member is provided with a resin layer A formed on the substrate, a transparent electrode layer B formed on the resin layer A, and a conductive layer C formed on the resin layer A and the transparent electrode layer B, wherein the resin layer A contains a resin (a) containing a carboxyl group, the conductive layer C contains a resin (c) having conductive particles and a carboxylic group, the conductive layer C contacts the resin layer A and the transparent electrode layer B, and, defining SA as the acid value of an organic component contained by the resin layer A and SC the acid value of an organic component contained by the resin layer C, the value of SA−SC is 20-150 mg KOH/g.
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Patent Agency Ranking
公开(公告)号：US09329477B2
公开(公告)日：2016-05-03
申请号：US14374407
申请日：2013-01-24
Applicant: Toray Industries, Inc.
Inventor： Satoshi Matsuba , Tsukuru Mizuguchi , Kazutaka Kusano
IPC: G03F7/038 , G03F7/30 , G03F7/40 , H01L21/027 , H05K3/12 , H01B1/20 , G03F7/004 , H01B1/22 , C09D5/24 , H05K1/09 , G03F7/16 , H05K3/02
CPC classification number: G03F7/038 , C09D5/24 , G03F7/004 , G03F7/0047 , G03F7/0388 , G03F7/168 , H01B1/22 , H05K1/095 , H05K3/02 , H05K2203/0514
Abstract: A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitie component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.
Abstract translation: 光敏导电膏提供具有良好储存稳定性的涂膜，能够在相对低温固化条件下保持高粘合性，并且还能够表现出高导电性。 感光性导电糊包含（A）导电性粒子，（B）感光性成分，（C）光聚合引发剂和（D）环氧树脂，其中环氧树脂（D）的环氧当量为200〜500g / 当量。
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公开(公告)号：US20200278609A1
公开(公告)日：2020-09-03
申请号：US16647763
申请日：2018-10-05
Applicant: Toray Industries, Inc.
Inventor： Tsukuru Mizuguchi , Marie Koyama
Abstract: A photosensitive conductive paste includes a quaternary ammonium salt compound (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a reactive monomer having an unsaturated double bond (D) and conductive particles (E). The photosensitive conductive paste exhibits conductivity at low temperature within a short time and is capable of forming fine wiring with excellent adhesion to ITO and bending resistance after being exposed to high-temperature and high-humidity environments by a photolithography method; and a film forms a conductive pattern.
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公开(公告)号：US10048583B2
公开(公告)日：2018-08-14
申请号：US15684469
申请日：2017-08-23
Applicant: TORAY INDUSTRIES, INC.
Inventor： Tsukuru Mizuguchi , Tomotaka Kawano
IPC: G03F7/20 , G03F7/004 , C08F220/12 , C08F220/06 , C08F222/20 , G03F7/11 , G03F7/038 , G03F7/16 , G03F7/26 , G06F3/044
Abstract: Provided is a method for manufacturing a conductive pattern forming member that is formed on a substrate and that has excellent resistance to ion migration between a conductive pattern and a photosensitive resin layer, while suppressing generation of residues in the dissolution and removal of unexposed portions. This method for manufacturing a conductive pattern forming member includes: a coating step of applying, onto surfaces of a layer A formed of a resin (a) having a carboxyl group, and a transparent electrode layer B, the layers A and B being formed over a substrate, a composition C containing conductive particles and a resin (c) having a double bond and a carboxyl group to obtain a coating film C; a drying step of drying the coating film C to obtain a dry film C; an exposure step of exposing the dry film C to light to obtain an exposed film C; a developing step of developing the exposed film C to obtain a pattern C; and a curing step of curing the pattern C to obtain a conductive pattern C, wherein particles having a particle diameter of 0.3 to 2.0 μm account for 80% or more of the conductive particles.
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公开(公告)号：US09081278B2
公开(公告)日：2015-07-14
申请号：US14386497
申请日：2013-03-04
Applicant: Toray Industries, Inc.
Inventor： Tsukuru Mizuguchi , Satoshi Matsuba , Kazutaka Kusano
CPC classification number: G03F7/0388 , G03F7/027 , G03F7/038 , G03F7/40 , G06F3/044 , G06F2203/04103 , H01B1/22
Abstract: A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).
Abstract translation: 感光性导电糊包含二羧酸或其酸酐（A）; 酸值为40〜200mg KOH / g的化合物（B） 脂环化合物（C）; 光聚合引发剂（D）; 和导电填料（E）。
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10.发明申请公开(公告)号：US20150050586A1
公开(公告)日：2015-02-19
申请号：US14386497
申请日：2013-03-04
Applicant: Toray Industries, Inc.
Inventor： Tsukuru Mizuguchi , Satoshi Matsuba , Kazutaka Kusano
CPC classification number: G03F7/0388 , G03F7/027 , G03F7/038 , G03F7/40 , G06F3/044 , G06F2203/04103 , H01B1/22
Abstract: A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).
Abstract translation: 感光性导电糊包含二羧酸或其酸酐（A）; 酸值为40〜200mg KOH / g的化合物（B） 脂环化合物（C）; 光聚合引发剂（D）; 和导电填料（E）。
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