Abstract:
A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitive component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.
Abstract:
A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.
Abstract:
A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.
Abstract:
A method of producing a conductive pattern includes a light-exposing step of exposing a layer or pattern including conductive particles A, an organic compound B having an unsaturated double bond and a photopolymerization initiator C, and positioned over a substrate to light rays having a broad spectrum, to thereby produce a conductive layer or a conductive pattern.
Abstract:
A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).
Abstract:
A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).
Abstract:
A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitie component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.
Abstract:
A method of producing a conductive pattern includes a light-exposing step of exposing a layer or pattern including conductive particles A, an organic compound B having an unsaturated double bond and a photopolymerization initiator C, and positioned over a substrate to light rays having a broad spectrum, to thereby produce a conductive layer or a conductive pattern.
Abstract:
A photosensitive conductive paste contains conductive particles (A), a photosensitive organic compound (B), an epoxy resin (C) and an ion adsorbent (D) that is selected from the group consisting of hydrotalcite, magnesium oxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, zirconium oxide, magnesium silicate, silicon dioxide, zeolite and a carbon-based powder.
Abstract:
A conductive paste can form a minute conductive pattern having markedly high adhesion and exhibiting conductivity at relatively low temperatures. The conductive paste contains: a compound (A) having a primary amino group, a secondary amino group, and a tertiary amino group; a compound (B) having a carboxyl group; and a conductive filler (C).