公开(公告)号：US20230378121A1

公开(公告)日：2023-11-23

申请号：US18318836

申请日：2023-05-17

Applicant: Tokyo Electron Limited

Inventor： Yuhei Matsuo

IPC: H01L23/00 ,  H04N23/56 ,  H04N23/90 ,  G06T7/73 ,  G06T7/00 ,  H04N23/10 ,  G06T7/90

CPC classification number: H01L24/75 ,  H01L24/94 ,  H01L24/83 ,  H04N23/56 ,  H04N23/90 ,  G06T7/73 ,  G06T7/0004 ,  H04N23/10 ,  G06T7/90 ,  H01L24/32 ,  H01L24/29 ,  H01L2224/29186 ,  H01L2924/0544 ,  H01L2924/0504 ,  H01L2924/059 ,  H01L2224/94 ,  H01L2224/32145 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/7598 ,  H01L2224/8313 ,  H01L2224/8316 ,  H01L2224/83896 ,  H01L2224/8301 ,  H01L2224/7501 ,  G06T2207/30204 ,  G06T2207/30148 ,  G06T2207/10024 ,  G06T2207/10152

Abstract: A bonding apparatus bonds a first substrate having a first alignment mark and a second substrate having a second alignment mark. A first radiation unit radiates white light to an imaging area of a first imaging unit when the second alignment mark is imaged by the first imaging unit. A second radiation unit radiates white light to an imaging area of a second imaging unit when the first alignment mark is imaged by the second imaging unit. A controller detects positions of the first alignment mark and the second alignment mark by processing images obtained by the first imaging unit and the second imaging unit, corrects the detected position of the first alignment mark based on a relationship between a wavelength and an intensity of reflection light reflected from the first substrate, and controls a moving unit based on the corrected position of the first alignment mark.