公开(公告)号：US08565911B2

公开(公告)日：2013-10-22

申请号：US13804452

申请日：2013-03-14

申请人： Tokyo Electron Limited

发明人： Yo Abe ,  Kiichi Takahashi ,  Junya Sato ,  Yoshinobu Motodate

IPC分类号： G06F7/00

CPC分类号： H01L21/67098 ,  H01L21/67109 ,  H01L21/67766 ,  H01L21/67781

摘要： When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.

摘要翻译： 当基板被保持臂转移到多层晶片舟皿时，防止了保持臂和基板之间的接触。 当晶片舟不受热效应时，通过相对于晶片舟相对地升高和降低转印基底构件，获得环形构件的正常高度位置。 在尚未热处理的晶片被转移到晶片舟皿之前，获得相应的环件的高度位置。 通过比较环状构件的正常高度位置与晶片运送前环状构件的高度位置之间的差异，可以判断是否通过晶片传送机构将晶片转移到晶片舟皿上。