公开(公告)号：US20220415693A1

公开(公告)日：2022-12-29

申请号：US17846605

申请日：2022-06-22

Applicant: Tokyo Electron Limited

Inventor： Hideto SAITO ,  Makoto KATO ,  Shin YAMAGUCHI ,  Takashi KANAZAWA ,  Ryoma MUTO

IPC: H01L21/683 ,  H01L21/67 ,  H01J37/32

Abstract: A substrate support includes an electrostatic chuck formed of ceramics and holding a substrate by electrostatic attraction, a base supporting the electrostatic chuck, and a flow path through which a heat exchange medium flows. An upper surface of the flow path is formed of ceramics.

公开(公告)号：US20250140535A1

公开(公告)日：2025-05-01

申请号：US19010578

申请日：2025-01-06

Applicant: Tokyo Electron Limited

Inventor： Takashi KANAZAWA ,  Shin YAMAGUCHI ,  Makoto KATO ,  Ryoma MUTO

IPC: H01J37/32

Abstract: A substrate processing apparatus includes a plasma processing chamber, a base arranged inside the plasma processing chamber, and an electrostatic chuck arranged on the base and having a substrate support surface and a ring support surface. The electrostatic chuck is configured to include a plurality of heat-transfer gas supply holes formed in the substrate support surface, an annular seal band formed on the substrate support surface around an outer periphery of the plurality of heat-transfer gas supply holes so as to surround the plurality of heat-transfer gas supply holes, and at least one first protrusion formed on the substrate support surface between a first heat-transfer gas supply hole closest to the seal band among the plurality of heat-transfer gas supply holes and the seal band.

公开(公告)号：US20240258083A1

公开(公告)日：2024-08-01

申请号：US18423391

申请日：2024-01-26

Applicant: Tokyo Electron Limited

Inventor： Makoto KATO ,  Ryoma MUTO ,  Kaisei SUGA

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32082 ,  H01J2237/002 ,  H01J2237/2007

Abstract: There is a substrate processing apparatus comprising: a processing chamber; a substrate support disposed in the chamber; and a power supply configured to supply a radio frequency (RF) power to at least the substrate support, wherein the substrate support includes: an electrostatic chuck that is made of ceramic and holds a substrate by electrostatic attraction; a base that has a channel through which a heat exchange medium flows and supports the electrostatic chuck; a low linear expansion coefficient member disposed between the electrostatic chuck and the base; a heat transfer sheet disposed between the low linear expansion coefficient member and the base; a fixing part configured to fix the heat transfer sheet to the low linear expansion coefficient member; and a conductive member that is disposed between the low linear expansion coefficient member and the base and electrically connects the low linear expansion coefficient member and the base.