公开(公告)号：US20190164727A1

公开(公告)日：2019-05-30

申请号：US16196088

申请日：2018-11-20

Applicant: Tokyo Electron Limited

Inventor： Naoki SUGAWA ,  Naoyuki SATOH ,  Kazuya NAGASEKI

IPC: H01J37/32 ,  H01L21/683

Abstract: A part for a semiconductor manufacturing apparatus, the part being enabled to cause electricity to pass through and including an insulating member.

公开(公告)号：US20210066053A1

公开(公告)日：2021-03-04

申请号：US16999451

申请日：2020-08-21

Applicant: Tokyo Electron Limited

Inventor： Hiroshi NAGAIKE ,  Naoki SUGAWA

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/66 ,  H01L21/683

Abstract: An annular member includes an annular member body to be disposed around a substrate in a substrate processing apparatus. A heterogeneous material portion is disposed in the annular member body and formed of a heterogeneous material different from a material of the annular member body.

公开(公告)号：US20190279894A1

公开(公告)日：2019-09-12

申请号：US16293788

申请日：2019-03-06

Applicant: Tokyo Electron Limited

Inventor： Yohei UCHIDA ,  Naoki SUGAWA ,  Katsushi ABE ,  Tsuyoshi HIDA

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.

公开(公告)号：US20210210369A1

公开(公告)日：2021-07-08

申请号：US17143399

申请日：2021-01-07

Applicant: Tokyo Electron Limited

Inventor： Naoki SUGAWA

IPC: H01L21/683 ,  H01J37/20 ,  H01J37/305 ,  H01L21/67

Abstract: A stage includes a first mounting part on which a substrate is mounted, a second mounting part on which an edge ring surrounding a peripheral edge of the substrate is mounted, the second mounting part being lower than the first mounting part, a first bonding layer configured to bond a base to the first mounting part, a second bonding layer configured to bond the base to the second mounting part, and a seal member configured to close a space between the first mounting part and the second mounting part by deformation of the seal member above the first bonding layer and the second bonding layer while contacting with each of the first mounting part and the second mounting part.

公开(公告)号：US20220336257A1

公开(公告)日：2022-10-20

申请号：US17811121

申请日：2022-07-07

Applicant: Tokyo Electron Limited

Inventor： Yohei UCHIDA ,  Naoki SUGAWA ,  Katsushi ABE ,  Tsuyoshi HIDA

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.