公开(公告)号：US20140239484A1

公开(公告)日：2014-08-28

申请号：US14184640

申请日：2014-02-19

申请人： Tokyo Electron Limited

发明人： Kenji MATSUDA ,  Dai SHINOZAKI ,  Muneo HARADA ,  Yoshinobu MITANO ,  Michikazu NAKAMURA ,  Itaru IIDA ,  Shinjiro WATANABE

IPC分类号： H01L21/71 ,  F27D21/00 ,  F27D11/02 ,  F27D19/00 ,  H01L23/373 ,  F27D7/02

CPC分类号： H01L23/3736 ,  F27B17/0025 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/67253 ,  H01L23/3735 ,  H01L2924/0002 ,  Y02P10/143 ,  H01L2924/00

摘要： In a method for forming a sintered silver coating film, for use as a heat spreader, on a semiconductor substrate or a semiconductor package, a coating film of an ink or paste containing silver nanoparticles is formed on one surface of the semiconductor substrate or the substrate package. Further, the coating film is sintered by heating the coating film under an atmosphere of a humidity of 30% to 50% RH (30° C.) by a ventilation oven.

摘要翻译： 在半导体衬底或半导体封装上形成用作散热器的烧结银涂膜的方法中，在半导体衬底或衬底的一个表面上形成含有银纳米颗粒的油墨或糊料的涂膜 包。 此外，通过通风烘箱在湿气为30％〜50％RH（30℃）的气氛下加热涂膜来烧结涂膜。

公开(公告)号：US20210166964A1

公开(公告)日：2021-06-03

申请号：US16770674

申请日：2018-11-29

申请人： Tokyo Electron Limited

发明人： Masayuki HARASHIMA ,  Michikazu NAKAMURA

IPC分类号： H01L21/683 ,  C23C16/32 ,  C23C16/458 ,  H01L21/02

摘要： There is provided a film forming apparatus for heating a target substrate on a stage, supplying a processing gas to the target substrate, and performing a film forming process on the target substrate, including: an accommodation part having an internal space for accommodating the stage, wherein the processing gas is supplied to the internal space and is inductively heated; a rotary shaft part configured to rotatably support the stage; and an elevating part configured to raise and lower the target substrate to deliver the target substrate between an external substrate transfer device and the stage, wherein at least one of the rotary shaft part and the elevating part is formed of a material having a thermal conductivity of 15 W/m·K or less and a melting point of 1,800 degrees C. or higher.

公开(公告)号：US20220098726A1

公开(公告)日：2022-03-31

申请号：US17425581

申请日：2020-01-27

申请人： Tokyo Electron Limited

发明人： Masayuki HARASHIMA ,  Yukio SANO ,  Michikazu NAKAMURA ,  Hirokatsu KOBAYASHI

IPC分类号： C23C16/32 ,  C23C16/44 ,  C23C16/458

摘要： A film forming method of forming a silicon carbide film on a substrate to be processed includes: forming the silicon carbide film on the substrate to be processed by loading a holder that holds the substrate to be processed into a processing container of a film forming apparatus to place the holder on a stage, and supplying a raw material gas into the processing container; and removing a reaction product, which has been adhered to a part other than the substrate to be processed during the forming the silicon carbide film, by loading a plate-shaped member having at least a surface formed by pyrolytic carbon into the processing container to place the plate-shaped member on the stage, and supplying a fluorine-containing gas into the processing container.

公开(公告)号：US20150059644A1

公开(公告)日：2015-03-05

申请号：US14458408

申请日：2014-08-13

申请人： Tokyo Electron Limited

发明人： Shinjiro WATANABE ,  Michikazu NAKAMURA

IPC分类号： B05C11/10 ,  H01L21/67 ,  B05C13/00 ,  B05B1/30 ,  B05C5/02

CPC分类号： B05C11/1021 ,  B05B1/3006 ,  B05C5/0208 ,  B05C5/0225 ,  B05C5/0258 ,  B05C13/00 ,  H01L21/6715

摘要： A coating film forming apparatus includes: a coating nozzle; a horizontal moving mechanism that relatively moves a substrate and the coating nozzle; a pressure regulating mechanism that regulates a pressure inside the coating nozzle; and a controller that changes an amount of the coating solution to be supplied from the coating nozzle, wherein the coating nozzle includes: a discharge port that is formed long in a direction perpendicular to a direction of the relative movement with respect to the substrate; and a storage chamber that communicates with the discharge port and stores the coating solution therein, and wherein while the coating solution is applied to the substrate, the pressure regulating mechanism is controlled according to a change in width of the substrate, to regulate the pressure inside the storage chamber to thereby change a discharge amount per unit time of the coating solution to be discharged.

摘要翻译： 涂膜形成装置包括：涂布喷嘴; 相对移动基板和涂布喷嘴的水平移动机构; 压力调节机构，其调节所述涂布喷嘴内的压力; 以及控制器，其改变从所述涂布喷嘴供给的涂布溶液的量，其中所述涂布喷嘴包括：排出口，其在垂直于相对于所述基板的所述相对运动方向的方向上形成得较长; 以及与排出口连通并将涂布溶液存储在其中的储存室，并且其中当将涂布溶液施加到基板上时，根据基板的宽度变化来控制压力调节机构，以调节内部的压力 储存室，从而改变要排出的涂布溶液的每单位时间的排出量。