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    Large area substrate processing system with between chamber platform
    1.
    发明授权
    Large area substrate processing system with between chamber platform 有权
    大面积基板处理系统与室间平台

    公开(公告)号：US08092138B2

    公开(公告)日：2012-01-10

    申请号：US12643034

    申请日：2009-12-21

    申请人： Thomas L. Duer ,  John A. Miller

    发明人： Thomas L. Duer ,  John A. Miller

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67742 ,  H01L21/67167

    摘要： Embodiments of the invention generally relate to a vacuum processing system for processing large area substrates, such as flat panel displays (i.e., LCD, OLED, and other types of flat panel displays), solar panels, and the like. In one embodiment, a vacuum processing system includes a plurality of processing chambers coupled to a vacuum transfer chamber suitable to accommodate a large area substrate and a least one horizontal platform disposed between adjacent processing chambers. The vacuum transfer chamber has a robot disposed therein. The platform is coupled to a base supporting one of the adjacent processing chambers.

    摘要翻译： 本发明的实施例一般涉及用于处理诸如平板显示器（即LCD，OLED和其它类型的平板显示器），太阳能电池板等的大面积基板的真空处理系统。 在一个实施例中，真空处理系统包括耦合到适于容纳大面积基板的真空传送室的多个处理室和设置在相邻处理室之间的至少一个水平平台。 真空传送室具有设置在其中的机器人。 平台联接到支撑相邻处理室之一的基座。

    LARGE AREA SUBSTRATE PROCESSING SYSTEM WITH BETWEEN CHAMBER PLATFORM
    2.
    发明申请
    LARGE AREA SUBSTRATE PROCESSING SYSTEM WITH BETWEEN CHAMBER PLATFORM 有权
    大面积基板处理系统与室间平台之间

    公开(公告)号：US20100158642A1

    公开(公告)日：2010-06-24

    申请号：US12643034

    申请日：2009-12-21

    申请人： Thomas L. Duer ,  John A. Miller

    发明人： Thomas L. Duer ,  John A. Miller

    IPC分类号： H01L21/677 ,  H01L21/67

    CPC分类号： H01L21/67742 ,  H01L21/67167

    摘要： Embodiments of the invention generally relate to a vacuum processing system for processing large area substrates, such as flat panel displays (i.e., LCD, OLED, and other types of flat panel displays), solar panels, and the like. In one embodiment, a vacuum processing system includes a plurality of processing chambers coupled to a vacuum transfer chamber suitable to accommodate a large area substrate and a least one horizontal platform disposed between adjacent processing chambers. The vacuum transfer chamber has a robot disposed therein. The platform is coupled to a base supporting one of the adjacent processing chambers.

    摘要翻译： 本发明的实施例一般涉及用于处理诸如平板显示器（即LCD，OLED和其它类型的平板显示器），太阳能电池板等的大面积基板的真空处理系统。 在一个实施例中，真空处理系统包括耦合到适于容纳大面积基板的真空传送室的多个处理室和设置在相邻处理室之间的至少一个水平平台。 真空传送室具有设置在其中的机器人。 平台联接到支撑相邻处理室之一的基座。

    Fertilizer application
    4.
    发明授权
    Fertilizer application 有权

    公开(公告)号：US10004175B1

    公开(公告)日：2018-06-26

    申请号：US15470990

    申请日：2017-03-28

    申请人： John A. Miller

    发明人： John A. Miller

    IPC分类号： A01C21/00 ,  A01C13/00 ,  A01C23/02

    CPC分类号： A01C21/002 ,  A01C5/066 ,  A01C13/00 ,  A01C23/024

    摘要： Fertilizer is applied between the rows of growing plants or to the bases of growing plants in adjacent rows. A dirt moving member then moves dirt and any applied fertilizer from between the rows onto the bases of the growing plants in the adjacent rows. The dirt acts to seal the fertilizer and to significantly reduce fertilizer losses.

    UP CUTTING KNIFE WITH SUCTION
    5.
    发明申请
    UP CUTTING KNIFE WITH SUCTION 有权
    用切割刀切割

    公开(公告)号：US20120197279A1

    公开(公告)日：2012-08-02

    申请号：US13015257

    申请日：2011-01-27

    申请人： Miguelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

    发明人： Miguelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

    IPC分类号： A61B17/32

    CPC分类号： A61B17/3211 ,  A61B17/1671 ,  A61B2217/005

    摘要： An up-cutting knife that has particular application for minimally invasive spinal surgical procedures. The knife includes an elongated tube that is operable to be inserted through a tubular retractor used in minimally invasive surgical procedures. One end of the elongated tube includes a curved head portion having a cutting blade formed on a top surface thereof and a suction port, and an opposite end of the tube is coupled to a handle having a chamber. A suction device can be coupled to an outlet port in the handle that causes blood and other surgical material to be drawn through the tube and out of the handle.

    摘要翻译： 一种特殊应用于微创脊柱外科手术的切割刀。 刀包括细长管，其可操作地插入通过用于微创外科手术的管状牵缩器。 细长管的一端包括弯曲头部，其具有形成在其顶表面上的切割刀片和吸入口，并且该管的相对端连接到具有腔室的手柄。 抽吸装置可以联接到手柄中的出口端口，其使得血液和其它手术材料通过管被拉出并从手柄中移出。

    Mirroring Data Between Redundant Storage Controllers Of A Storage System
    7.
    发明申请
    Mirroring Data Between Redundant Storage Controllers Of A Storage System 有权
    在存储系统的冗余存储控制器之间镜像数据

    公开(公告)号：US20110131373A1

    公开(公告)日：2011-06-02

    申请号：US12627440

    申请日：2009-11-30

    申请人： Pankaj Kumar ,  Hang T. Nguyen ,  Mark Yarch ,  Timothy J. Jehl ,  John A. Miller

    发明人： Pankaj Kumar ,  Hang T. Nguyen ,  Mark Yarch ,  Timothy J. Jehl ,  John A. Miller

    IPC分类号： G06F12/08 ,  G06F12/00 ,  G06F12/16

    CPC分类号： G06F11/2089 ,  G06F11/2097

    摘要： In one embodiment, the present invention includes canisters to control storage of data in a storage system including a plurality of disks. Each of multiple canisters may have a processor configured for uniprocessor mode and having an internal node identifier to identify the processor and an external node identifier to identify another processor with which it is to mirror cached data. The mirroring of cached data may be performed by communication of non-coherent transactions via the PtP interconnect, wherein the PtP interconnect is according to a cache coherent protocol. Other embodiments are described and claimed.

    摘要翻译： 在一个实施例中，本发明包括用于控制包括多个盘的存储系统中的数据存储的罐。 多个罐中的每一个可以具有配置成用于单处理器模式并具有内部节点标识符以识别处理器和外部节点标识符的处理器，以识别用于镜像缓存数据的另一个处理器。 缓存数据的镜像可以通过经由PtP互连的非相干事务的通信来执行，其中PtP互连是根据高速缓存一致性协议。 描述和要求保护其他实施例。

    Minimally Invasive Interbody Device
    8.
    发明申请
    Minimally Invasive Interbody Device 审中-公开
    微创体内器件

    公开(公告)号：US20110046743A1

    公开(公告)日：2011-02-24

    申请号：US12917089

    申请日：2010-11-01

    申请人： Miquelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

    发明人： Miquelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

    IPC分类号： A61F2/44

    CPC分类号： A61F2/4455 ,  A61B2017/0256 ,  A61F2/447 ,  A61F2/4601 ,  A61F2/4611 ,  A61F2002/3008 ,  A61F2002/30166 ,  A61F2002/30235 ,  A61F2002/30367 ,  A61F2002/30426 ,  A61F2002/3082 ,  A61F2002/4627 ,  A61F2002/4629 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2230/0028 ,  A61F2230/0069 ,  A61F2250/0098 ,  A61F2310/00023

    摘要： An interbody device that restores the disc space height between two vertebrae during spinal fusion surgery. The device includes a center plate surrounded by a perimeter portion that combine to have a relatively flat configuration in one dimension and relatively wide configuration in a perpendicular dimension. After the disc space has been cleared, the device is inserted into the disc space in a direction so that the wide dimension of the device is substantially parallel to the body of the vertebrae. The device is then rotated so that the wide dimension of the device becomes perpendicular to the vertebral body so as to cause the disc space height to be restored. Bone graft material is then introduced through a fill tube coupled to the device so that the bone graft material is distributed on both sides of the center plate and into the disc space.

    摘要翻译： 一种椎体内装置，可恢复脊柱融合手术期间椎间盘高度。 该装置包括由周边部分围绕的中心板，该中心板在一个维度上组合成具有相对平坦的构造，在垂直方向上具有相对宽的构造。 在盘空间已经被清除之后，装置沿着一个方向插入到盘片空间中，使得装置的宽尺寸基本上平行于椎骨的主体。 然后使装置旋转，使得装置的宽尺寸变得垂直于椎体，以便使椎间盘空间高度恢复。 骨移植材料然后通过连接到该装置的填充管引入，使得骨移植材料分布在中心板的两侧并进入椎间盘空间。

    IC CHIP UNIFORM DELAYERING METHODS
    9.
    发明申请
    IC CHIP UNIFORM DELAYERING METHODS 失效
    IC芯片均匀延迟方法

    公开(公告)号：US20080233751A1

    公开(公告)日：2008-09-25

    申请号：US11690432

    申请日：2007-03-23

    申请人： Keith E. Barton ,  Thomas A. Bauer ,  Stanley J. Klepeis ,  John A. Miller ,  Yun-Yu Wang

    发明人： Keith E. Barton ,  Thomas A. Bauer ,  Stanley J. Klepeis ,  John A. Miller ,  Yun-Yu Wang

    IPC分类号： H01L21/461

    CPC分类号： G01N1/32 ,  H01L22/24

    摘要： Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the wafer using a slurry including an approximately 30 μm polishing particles; removing the aluminum layer and at least one metal layer by polishing using a slurry including approximately 9 μm diamond polishing particles and a non-abrasive backside of a polishing sheet; removing any remaining metal layers to a first metal layer by polishing using a slurry including approximately 3 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; removing any scratches by polishing using a slurry including approximately 1 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; and removing the first metal layer to a polyconductor layer by polishing using a colloidal slurry including approximately 0.25 μm diamond polishing particles.

    摘要翻译： 公开了均匀地延迟IC芯片的方法。 一个实施例包括：在包括其Al层的晶片上执行灰分并蚀刻Al层; 使用包含约30μm的抛光颗粒的浆料抛光晶片的边缘; 通过使用包含大约9μm的金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光来去除铝层和至少一个金属层; 通过使用包含大约3μm的金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光，将任何剩余的金属层除去到第一金属层; 通过使用包括大约1毫米金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光来除去任何划痕; 并且通过使用包含大约0.25μm金刚石抛光颗粒的胶体浆料进行抛光将第一金属层去除到多导体层。