THERMOPLASTIC POLYAMIDE MOLDING COMPOSITIONS THAT RESIST HEAT

    公开(公告)号:US20230102597A1

    公开(公告)日:2023-03-30

    申请号:US17759213

    申请日:2021-01-26

    申请人: BASF SE

    IPC分类号: C08L77/06

    摘要: Disclosed herein is a thermoplastic molding composition which includes A) from 10 to 99.9% by weight of a thermoplastic polyamide, B) from 0.1 to 20% by weight of at least one hyperbranched polyester having an acid number in the range of from 10 to 700 mg KOH/g and a hydroxyl number in the range of from 0 to 550 mg KOH/g, C) from 0 to 50% by weight of fibrous or particulate fillers, and D) from 0 to 45% by weight of further additives, where the total of the percentages by weight of components A) to D) is 100% by weight.