COPPER-ANF COMPOSITE CONDUCTOR FABRICATION
    3.
    发明公开

    公开(公告)号:US20230260680A1

    公开(公告)日:2023-08-17

    申请号:US18014244

    申请日:2021-07-01

    CPC classification number: H01B13/30 H01B1/22

    Abstract: A method of fabricating a conductor includes preparing an aramid nanofiber solution in which a matrix of aramid nanofibers is dispersed, preparing a dispersion of copper nanoparticles, each copper nanoparticle of the dispersion of cooper nanoparticles having an organic capping ligand attached to the copper nanoparticle, and incorporating copper nanoparticles of the dispersion of copper nanoparticles into the matrix of aramid nanofibers such that each incorporated copper nanoparticle is bonded to a respective aramid nanofiber of the matrix of aramid nanofibers via the organic capping ligand to which the copper nanoparticle is attached. The organic capping ligand may include a mercaptocarboxyiic acid.

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