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公开(公告)号:US10588982B2
公开(公告)日:2020-03-17
申请号:US15727490
申请日:2017-10-06
Applicant: The Regents of the University of California
Inventor: Diana Lac , Chun Feng , Gaurav Bhardwaj , Siddarth Chandrasekaran , Kit S. Lam
IPC: A61K47/65 , C07D495/04 , C07D403/12 , A61K47/68
Abstract: Methods and compositions are described herein for covalently linking an antibody to a molecular payload. Compositions are described herein containing an antibody covalently linked to a molecular payload.