Invention Grant
- Patent Title: Site-specific covalent chemical ligation to monoclonal and polyclonal immunoglobulin
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Application No.: US15727490Application Date: 2017-10-06
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Publication No.: US10588982B2Publication Date: 2020-03-17
- Inventor: Diana Lac , Chun Feng , Gaurav Bhardwaj , Siddarth Chandrasekaran , Kit S. Lam
- Applicant: The Regents of the University of California
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C.
- Main IPC: A61K47/65
- IPC: A61K47/65 ; C07D495/04 ; C07D403/12 ; A61K47/68
Abstract:
Methods and compositions are described herein for covalently linking an antibody to a molecular payload. Compositions are described herein containing an antibody covalently linked to a molecular payload.
Public/Granted literature
- US20180140715A1 SITE-SPECIFIC COVALENT CHEMICAL LIGATION TO MONOCLONAL AND POLYCLONAL IMMUNOGLOBULIN Public/Granted day:2018-05-24
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