公开(公告)号：US08110904B2

公开(公告)日：2012-02-07

申请号：US13023906

申请日：2011-02-09

申请人： Yasuko Imanishi ,  Takahiro Fukunaga

发明人： Yasuko Imanishi ,  Takahiro Fukunaga

IPC分类号： H01L23/495

CPC分类号： H01L23/49586 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided are a semiconductor device lead frame and a method of manufacturing of the same that improve adhesive properties between plating layers when a plurality of plating layers are laminated, that control deterioration in wire bonding properties during the manufacturing process of a semiconductor device and worsening of solderability during packaging, and that effectively reduce manufacturing cost. Specifically, the lead frame (2a, 2b) has a laminated structure that includes a lower plating layer (22) formed on a conductive base material (21) and an uppermost plating layer (23), with an organic film (22) that has metal-binding properties formed between the lower plating layer (21) and the uppermost plating layer (23). The organic film (22) is formed as a monomolecular film in which functional organic molecules (11) self assemble. Each of the organic molecules (11) has functional groups (A1, A1) with metal-binding properties on both ends of a main chain (B1).

摘要翻译： 提供一种半导体器件引线框架及其制造方法，其在层叠多个镀层时提高镀层之间的粘合性，控制半导体器件的制造过程中的引线接合性能的劣化和可焊性的恶化 在包装过程中，有效降低制造成本。 具体而言，引线框架（2a，2b）具有层叠结构，该叠层结构包括形成在导电性基材（21）上的下镀层（22）和最上层镀层（23），有机膜（22）具有 在下镀层（21）和最上镀层（23）之间形成的金属结合性。 有机膜（22）形成为功能性有机分子（11）自组装的单分子膜。 每个有机分子（11）具有在主链（B1）的两端具有金属结合性质的官能团（A1，A1）。

公开(公告)号：US20110169033A1

公开(公告)日：2011-07-14

申请号：US13062408

申请日：2009-12-24

申请人： Takahiro Fukunaga ,  Yasuko Imanishi

发明人： Takahiro Fukunaga ,  Yasuko Imanishi

IPC分类号： H01L33/60 ,  H01B3/30

CPC分类号： H01L33/52 ,  C07D249/12 ,  C07D251/20 ,  C07D251/38 ,  C07D487/04 ,  C08G61/10 ,  C08G2261/1646 ,  C08G2261/312 ,  C08G2261/3221 ,  C23C28/00 ,  H01L23/296 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics.For these purposes, an organic film 110 is formed through self-assembly by functional organic molecules 11 at surface border regions of outer leads 301a of a QFP 10. The functional organic molecules 11 consist of a first functional group A1 bonding with metals, a principal chain B1, and a second functional group C1 inducing hardening in thermosetting resins. The principal chain B1 consists of a glycol chain, or else of a glycol chain and one or more among methylene, fluoromethylene, or siloxane chains. The principal chain B1 also preferably includes one or more among a hydroxyl radical, ketone, thioketone, primary amine, secondary amine, and aromatic compounds.

摘要翻译： 提供了具有良好的电连接性和接合强度的约束树脂毛刺形成的目的的半导体器件及其制造方法以及提供硅树脂和引线之间的粘合性同时具有良好发光特性的目的。 为了这些目的，通过在QFP10的外引线301a的表面边界区域处的功能性有机分子11自组装形成有机膜110.功能性有机分子11由与金属键合的第一官能团A1，主体 链B1和在热固性树脂中引起硬化的第二官能团C1。 主链B1由二醇链或二醇链的另一个或亚甲基，氟亚甲基或硅氧烷链中的一个或多个组成。 主链B1还优选包括羟基，酮，硫酮，伯胺，仲胺和芳族化合物中的一种或多种。

公开(公告)号：US08946746B2

公开(公告)日：2015-02-03

申请号：US13062408

申请日：2009-12-24

申请人： Takahiro Fukunaga ,  Yasuko Imanishi

发明人： Takahiro Fukunaga ,  Yasuko Imanishi

IPC分类号： H01L33/22 ,  C07D487/04 ,  C07D249/12 ,  C07D251/20 ,  C07D251/38 ,  C08G61/10 ,  C23C28/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L33/52 ,  C07D249/12 ,  C07D251/20 ,  C07D251/38 ,  C07D487/04 ,  C08G61/10 ,  C08G2261/1646 ,  C08G2261/312 ,  C08G2261/3221 ,  C23C28/00 ,  H01L23/296 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics.

摘要翻译： 提供了具有良好的电连接性和接合强度的约束树脂毛刺形成的目的的半导体器件及其制造方法以及提供硅树脂和引线之间的粘附性同时具有良好的发光特性的目的。