Lead frame for semiconductor device and method of manufacturing of the same
    1.
    发明授权
    Lead frame for semiconductor device and method of manufacturing of the same 有权
    用于半导体器件的引线框架及其制造方法

    公开(公告)号:US08110904B2

    公开(公告)日:2012-02-07

    申请号:US13023906

    申请日:2011-02-09

    IPC分类号: H01L23/495

    摘要: Provided are a semiconductor device lead frame and a method of manufacturing of the same that improve adhesive properties between plating layers when a plurality of plating layers are laminated, that control deterioration in wire bonding properties during the manufacturing process of a semiconductor device and worsening of solderability during packaging, and that effectively reduce manufacturing cost. Specifically, the lead frame (2a, 2b) has a laminated structure that includes a lower plating layer (22) formed on a conductive base material (21) and an uppermost plating layer (23), with an organic film (22) that has metal-binding properties formed between the lower plating layer (21) and the uppermost plating layer (23). The organic film (22) is formed as a monomolecular film in which functional organic molecules (11) self assemble. Each of the organic molecules (11) has functional groups (A1, A1) with metal-binding properties on both ends of a main chain (B1).

    摘要翻译: 提供一种半导体器件引线框架及其制造方法,其在层叠多个镀层时提高镀层之间的粘合性,控制半导体器件的制造过程中的引线接合性能的劣化和可焊性的恶化 在包装过程中,有效降低制造成本。 具体而言,引线框架(2a,2b)具有层叠结构,该叠层结构包括形成在导电性基材(21)上的下镀层(22)和最上层镀层(23),有机膜(22)具有 在下镀层(21)和最上镀层(23)之间形成的金属结合性。 有机膜(22)形成为功能性有机分子(11)自组装的单分子膜。 每个有机分子(11)具有在主链(B1)的两端具有金属结合性质的官能团(A1,A1)。