公开(公告)号：US12009575B2

公开(公告)日：2024-06-11

申请号：US18302003

申请日：2023-04-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q21/24 ,  H01L23/00 ,  H01L23/06 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q19/30 ,  H01Q21/00 ,  H01Q15/14 ,  H01Q21/28

CPC classification number: H01Q1/2283 ,  H01L23/3107 ,  H01L23/552 ,  H01L23/66 ,  H01L24/13 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q1/526 ,  H01Q19/30 ,  H01Q21/0087 ,  H01Q21/24 ,  H01L23/3128 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/18 ,  H01L2924/19102 ,  H01L2924/3025 ,  H01Q15/14 ,  H01Q21/28

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

公开(公告)号：US20230261361A1

公开(公告)日：2023-08-17

申请号：US18302003

申请日：2023-04-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01Q21/00 ,  H01Q21/24 ,  H01L23/31 ,  H01Q19/30 ,  H01Q1/52

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L24/13 ,  H01L23/552 ,  H01Q21/0087 ,  H01Q21/24 ,  H01L23/3107 ,  H01Q19/30 ,  H01Q1/526 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q15/14

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

公开(公告)号：US11658392B2

公开(公告)日：2023-05-23

申请号：US17351256

申请日：2021-06-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q19/30 ,  H01Q21/00 ,  H01Q21/24 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/31 ,  H01Q15/14 ,  H01Q21/28

CPC classification number: H01Q1/2283 ,  H01L23/3107 ,  H01L23/552 ,  H01L23/66 ,  H01L24/13 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q1/526 ,  H01Q19/30 ,  H01Q21/0087 ,  H01Q21/24 ,  H01L23/3128 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/02331 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/18 ,  H01L2924/19102 ,  H01L2924/3025 ,  H01Q15/14 ,  H01Q21/28

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

公开(公告)号：US11335655B2

公开(公告)日：2022-05-17

申请号：US17120287

申请日：2020-12-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Albert Wan ,  Chao-Wen Shih ,  Shou-Zen Chang ,  Nan-Chin Chuang

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/48 ,  H01L23/31 ,  H01L23/60 ,  H01L21/56 ,  H01L21/683 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q9/30 ,  H01L21/66

Abstract: A package structure include a ground plate, a semiconductor die, a molding compound, and an antenna element. The semiconductor die is located over the ground plate. The molding compound is located over the semiconductor die. The antenna element is located in the molding compound and overlaps with the ground plate along a stacking direction of the ground plate, the semiconductor die and the molding compound. The antenna element has a first side levelled with a first surface of the molding compound, and the ground plate is located between the semiconductor die and the antenna element.

公开(公告)号：US20210313671A1

公开(公告)日：2021-10-07

申请号：US17351256

申请日：2021-06-18

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01Q21/00 ,  H01Q21/24 ,  H01L23/31 ,  H01Q19/30 ,  H01Q1/52

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

公开(公告)号：US20210098396A1

公开(公告)日：2021-04-01

申请号：US17120287

申请日：2020-12-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Albert Wan ,  Chao-Wen Shih ,  Shou-Zen Chang ,  Nan-Chin Chuang

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/48 ,  H01L23/31 ,  H01L23/60 ,  H01L21/56 ,  H01L21/683 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q9/30

Abstract: A package structure include a ground plate, a semiconductor die, a molding compound, and an antenna element. The semiconductor die is located over the ground plate. The molding compound is located over the semiconductor die. The antenna element is located in the molding compound and overlaps with the ground plate along a stacking direction of the ground plate, the semiconductor die and the molding compound. The antenna element has a first side levelled with a first surface of the molding compound, and the ground plate is located between the semiconductor die and the antenna element.