公开(公告)号：US09671457B2

公开(公告)日：2017-06-06

申请号：US14561442

申请日：2014-12-05

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Mill-Jer Wang ,  Chih-Chia Chen ,  Hung-Chih Lin ,  Ching-Nen Peng ,  Hao Chen

IPC: G01R31/20 ,  G01R31/28 ,  G01R1/073 ,  H01L21/66

CPC classification number: G01R31/2884 ,  G01R1/07378 ,  G01R31/2834 ,  G01R31/2886 ,  H01L22/14 ,  Y02P80/30

Abstract: A method comprises connecting a testing setup having a plurality of probes to a device under test having a plurality of vias, wherein a probe is aligned with a corresponding via of the device under test and conducting a plurality of via electrical characteristic tests through a conductive path comprising the vias, the probes and a plurality of conductive devices, each of which connects two adjacent probes, wherein the conductive devices are in the testing setup.

公开(公告)号：US20150087089A1

公开(公告)日：2015-03-26

申请号：US14561442

申请日：2014-12-05

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Mill-Jer Wang ,  Chih-Chia Chen ,  Hung-Chih Lin ,  Ching-Nen Peng ,  Hao Chen

IPC: G01R31/28 ,  G01R1/073 ,  H01L21/66

CPC classification number: G01R31/2884 ,  G01R1/07378 ,  G01R31/2834 ,  G01R31/2886 ,  H01L22/14 ,  Y02P80/30

Abstract: A method comprises connecting a testing setup having a plurality of probes to a device under test having a plurality of vias, wherein a probe is aligned with a corresponding via of the device under test and conducting a plurality of via electrical characteristic tests through a conductive path comprising the vias, the probes and a plurality of conductive devices, each of which connects two adjacent probes, wherein the conductive devices are in the testing setup.

Abstract translation: 一种方法包括将具有多个探针的测试装置连接到具有多个通孔的被测器件，其中探针与被测器件的相应通孔对准，并通过导电通路进行多次通孔电特性测试 包括通孔，探针和多个导电装置，每个导电装置连接两个相邻的探针，其中导电装置处于测试装置中。