公开(公告)号：US20210202239A1

公开(公告)日：2021-07-01

申请号：US16727533

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hui-Chi Huang ,  Jeng-Chi Lin ,  Pin-Chuan Su ,  Chien-Ming Wang ,  Kei-Wei Chen

IPC: H01L21/02 ,  B08B7/04 ,  B08B1/00 ,  B08B1/04 ,  B08B3/08 ,  B08B5/04 ,  A46B13/04

Abstract: A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

公开(公告)号：US11664213B2

公开(公告)日：2023-05-30

申请号：US16727533

申请日：2019-12-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hui-Chi Huang ,  Jeng-Chi Lin ,  Pin-Chuan Su ,  Chien-Ming Wang ,  Kei-Wei Chen

IPC: B08B7/04 ,  H01L21/02 ,  B08B1/00 ,  B08B3/08 ,  B08B5/04 ,  A46B13/04 ,  B08B1/04

CPC classification number: H01L21/02087 ,  A46B13/04 ,  B08B1/002 ,  B08B1/04 ,  B08B3/08 ,  B08B5/04 ,  B08B7/04 ,  A46B2200/30

Abstract: A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.