公开(公告)号：US20240387489A1

公开(公告)日：2024-11-21

申请号：US18318447

申请日：2023-05-16

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Chia LIN ,  Chih-Hsin LU ,  Chung-Hao TSAI ,  Hsing-Kuo HSIA ,  Chuei-Tang WANG ,  Chen-Hua YU

IPC: H01L25/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H10B80/00

Abstract: A package structure is provided, and includes an interposer, a control unit, a plurality of computing units, a signal transmission layer, and an electric-optical material. The control unit is bonded to the interposer. The computing units are disposed around and connected to the control unit. The signal transmission layer is formed in the control unit and the computing units. The electric-optical material is formed in the control unit and the computing units, and the electric-optical material overlaps the signal transmission layer.

公开(公告)号：US20240393653A1

公开(公告)日：2024-11-28

申请号：US18323483

申请日：2023-05-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Hsin LU ,  Chia-Chia LIN ,  Ching-Ho CHIN ,  Chung-Hao TSAI ,  Chuei-Tang WANG ,  Chen-Hua YU

IPC: G02F1/19 ,  G02F1/01 ,  H01L21/768 ,  H01L23/48 ,  H01L25/00 ,  H01L25/065 ,  H01L27/144

Abstract: A package structure and method for forming the same are provided. The package structure includes a substrate having a front-side surface and a back-side surface, and an electrical device formed over the front-side surface of a substrate. The package structure includes a dielectric layer formed below and in direct contact with the back-side surface of the substrate, and a first optical device formed in the dielectric layer. The package structure also includes a protective layer formed below or above the first optical device; and an electro-optic effect material layer formed in the protective layer.

公开(公告)号：US20240387329A1

公开(公告)日：2024-11-21

申请号：US18320398

申请日：2023-05-19

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Hsin LU ,  Chia-Chia LIN ,  Ching-Ho CHIN ,  Chung-Hao TSAI ,  Chuei-Tang WANG ,  Chen-Hua YU

IPC: H01L23/48 ,  G02B6/122 ,  H01L21/768 ,  H01L23/498 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

Abstract: A package structure and a formation method are provided. The method includes forming electrical devices over a substrate and forming an interconnect structure over front sides of the electrical devices. The method also includes thinning the substrate and forming backside through vias connecting to backsides of the electrical devices. The method also includes attaching a waveguide layer over backsides of the electrical devices and forming conductive vias through the waveguide layer and electrically connected to the backside through vias.