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公开(公告)号:US10970167B2
公开(公告)日:2021-04-06
申请号:US16743445
申请日:2020-01-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Yin Liu , Yu-Der Chih , Hsueh-Chih Yang , Jonathan Tehan Chen , Kuan-Chun Chen
Abstract: A method includes: retrieving a first word comprising a plurality of data bits and a plurality of parity bits that correspond to the first word, wherein the plurality of data bits form N−1 groups and the plurality of parity bits form a first group different from the N−1 groups, and N is a positive integer greater than 2; receiving a request to update respective data bits of a first one of the N−1 groups; and providing a second word comprising updated data bits that form a second one of the N−1 groups and a plurality of updated parity bits that correspond to the second word, wherein the plurality of updated parity bits form a second group that has a same group index as the first one of the N−1 groups.
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公开(公告)号:US11556414B2
公开(公告)日:2023-01-17
申请号:US17222919
申请日:2021-04-05
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Yin Liu , Yu-Der Chih , Hsueh-Chih Yang , Jonathan Tehan Chen , Kuan-Chun Chen
Abstract: A method includes: retrieving a first word comprising a plurality of data bits and a plurality of parity bits that correspond to the first word, wherein the plurality of data bits form N−1 groups and the plurality of parity bits form a first group different from the N−1 groups, and N is a positive integer greater than 2; receiving a request to update respective data bits of a first one of the N−1 groups; and providing a second word comprising updated data bits that form a second one of the N−1 groups and a plurality of updated parity bits that correspond to the second word, wherein the plurality of updated parity bits form a second group that has a same group index as the first one of the N−1 groups.
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公开(公告)号:US10599517B2
公开(公告)日:2020-03-24
申请号:US15965883
申请日:2018-04-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Yin Liu , Yu-Der Chih , Hsueh-Chih Yang , Jonathan Tehan Chen , Kuan-Chun Chen
Abstract: A method includes: retrieving a first word comprising a plurality of data bits and a plurality of parity bits that correspond to the first word, wherein the plurality of data bits form N−1 groups and the plurality of parity bits form a first group different from the N−1 groups, and N is a positive integer greater than 2; receiving a request to update respective data bits of a first one of the N−1 groups; and providing a second word comprising updated data bits that form a second one of the N−1 groups and a plurality of updated parity bits that correspond to the second word, wherein the plurality of updated parity bits form a second group that has a same group index as the first one of the N−1 groups.
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公开(公告)号:US20200151057A1
公开(公告)日:2020-05-14
申请号:US16743445
申请日:2020-01-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chien-Yin Liu , Yu-Der Chih , Hsueh-Chih Yang , Jonathan Tehan Chen , Kuan-Chun Chen
Abstract: A method includes: retrieving a first word comprising a plurality of data bits and a plurality of parity bits that correspond to the first word, wherein the plurality of data bits form N−1 groups and the plurality of parity bits form a first group different from the N−1 groups, and N is a positive integer greater than 2; receiving a request to update respective data bits of a first one of the N−1 groups; and providing a second word comprising updated data bits that form a second one of the N−1 groups and a plurality of updated parity bits that correspond to the second word, wherein the plurality of updated parity bits form a second group that has a same group index as the first one of the N−1 groups.
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公开(公告)号:US09922962B2
公开(公告)日:2018-03-20
申请号:US15485294
申请日:2017-04-12
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Chung-Cheng Chou , Po-Hao Lee , Jonathan Tehan Chen
IPC: F25B21/02 , H01L25/065 , H01L23/38
CPC classification number: H01L25/0657 , F25B21/02 , F25B2321/0212 , H01L23/38 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.
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公开(公告)号:US09625186B2
公开(公告)日:2017-04-18
申请号:US14013125
申请日:2013-08-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chung-Cheng Chou , Po-Hao Lee , Jonathan Tehan Chen
CPC classification number: H01L25/0657 , F25B21/02 , F25B2321/0212 , H01L23/38 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.
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