公开(公告)号：US20230351577A1

公开(公告)日：2023-11-02

申请号：US17730585

申请日：2022-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： I-Hsuan Chen ,  Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Hu-Wei Lin

IPC: G01N21/95 ,  G01N1/44 ,  G01N35/00 ,  H04N5/372 ,  H01L21/66 ,  G06T7/00 ,  G06T7/70

CPC classification number: G06T7/0004 ,  G01N1/44 ,  G01N21/9501 ,  G01N35/00 ,  G06T7/70 ,  H01L22/12 ,  H04N5/372 ,  G01N2035/00346 ,  G06T2207/30148

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.