公开(公告)号：US09110386B2

公开(公告)日：2015-08-18

申请号：US14300499

申请日：2014-06-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Pan Wang ,  Chien-Hsuan Liu ,  Ching-Hsien Chen ,  Chao-Chi Chen

IPC: G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70641 ,  G03F7/70341 ,  G03F9/7026 ,  G03F9/7034 ,  G03F9/7053

Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.

Abstract translation: 一种方法包括提供在衬底上具有至少一层材料的半导体衬底。 对基板施加声音，使得声波被材料层的顶表面反射。使用传感器检测声波。 基于检测到的声波来确定顶面的形貌。 确定的地形用于控制浸没光刻工艺。