DENSELY PACKED VCSEL ARRAY
    1.
    发明申请

    公开(公告)号:US20220376479A1

    公开(公告)日:2022-11-24

    申请号:US17741487

    申请日:2022-05-11

    Abstract: A semiconductor device comprising an array of vertical cavity surface emitting lasers (VCSELs). The semiconductor device includes a first VCSEL having a first active area, a second VCSEL having a second active area, and a bridge connecting the first VCSEL and the second VCSEL. The first active area of the first VCSEL and the second active area of the second VCSEL are arranged along a first crystal axis. The semiconductor device further includes a blocking structure arranged between the first VCSEL and the second VCSEL. the blocking structure is configured to block a propagation of a defect between the first VCSEL and the second VCSEL along the first crystal axis.

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