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公开(公告)号:US20190263065A1
公开(公告)日:2019-08-29
申请号:US16407389
申请日:2019-05-09
Applicant: TRUMPF Laser- und Systemtechnik GmbH
Inventor: Uwe Huber , Johannes Bauer , Michael Thielmann , Joachim Wagner , Jürgen Ortmann , Matthias Allenberg-Rabe , Detlef Breitling , Damien Buchbinder , Florian Krist
IPC: B29C64/268 , B29C64/153 , B29C64/393 , B22F3/105 , B28B17/00 , B28B1/00 , B33Y10/00 , B33Y50/02 , B33Y30/00
Abstract: The disclosure provides methods of additive manufacture of components in layers in a powder bed by at least two laser beams that can be deflected two-dimensionally over the same powder bed region. Each laser focal spot is projected onto the power bed and is or is set to a diameter of less than or equal to 300 μm. Components to be produced in the powder bed region are manufactured by each of the laser beams, and each individual surface contour of the component is manufactured solely by one of the laser beams.
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公开(公告)号:US11899421B2
公开(公告)日:2024-02-13
申请号:US16408557
申请日:2019-05-10
Applicant: TRUMPF Laser-und Systemtechnik GmbH
Inventor: Matthias Allenberg-Rabe , Jürgen Ortmann
IPC: G05B19/401 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B23K26/082 , B23K26/354 , B23K26/34 , B23K26/342 , G02B26/10 , B29C64/268 , B29C64/153 , B22F10/31 , B22F12/49 , G01S5/16 , G02B5/122 , G02B27/62 , G02B7/00 , B22F10/28 , B22F12/41 , B22F12/44
CPC classification number: G05B19/401 , B22F10/31 , B22F12/49 , B23K26/082 , B23K26/34 , B23K26/342 , B23K26/354 , B29C64/153 , B29C64/268 , B33Y10/00 , B33Y30/00 , B33Y50/02 , G02B26/101 , B22F10/28 , B22F12/41 , B22F12/44 , B22F2998/10 , B22F2999/00 , G01S5/16 , G02B5/122 , G02B7/003 , G02B27/62 , G05B2219/49018 , Y02P10/25 , B22F2999/00 , B22F12/49 , B22F2203/03
Abstract: The present disclosure relates to calibrating scanner devices for positioning laser beams in a processing field, and includes, e.g.: arranging a retroreflector in the processing field of the scanner device, the processing field being formed in a processing chamber for irradiating powder layers; detecting laser radiation reflected back into the scanner device when the laser beam passes over the retroreflector; determining an actual position of the laser beam in the processing field using the detected laser radiation; and calibrating the scanner device by correcting a laser beam target position specified for the scanner device in the processing field using the determined actual position of the laser beam in the processing field.
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公开(公告)号:US11986995B2
公开(公告)日:2024-05-21
申请号:US16407389
申请日:2019-05-09
Applicant: TRUMPF Laser- und Systemtechnik GmbH
Inventor: Uwe Huber , Johannes Bauer , Michael Thielmann , Joachim Wagner , Jürgen Ortmann , Matthias Allenberg-Rabe , Detlef Breitling , Damien Buchbinder , Florian Krist
IPC: B29C64/153 , B22F10/28 , B22F10/36 , B22F10/366 , B22F12/45 , B28B1/00 , B28B17/00 , B29C64/268 , B29C64/277 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B22F12/49
CPC classification number: B29C64/153 , B22F10/28 , B22F10/36 , B22F10/366 , B22F12/45 , B28B1/001 , B28B17/0081 , B29C64/268 , B29C64/277 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B22F12/49 , Y02P10/25 , B22F2999/00 , B22F10/38 , B22F10/366 , B22F12/45
Abstract: The disclosure provides methods of additive manufacture of components in layers in a powder bed by at least two laser beams that can be deflected two-dimensionally over the same powder bed region. Each laser focal spot is projected onto the power bed and is or is set to a diameter of less than or equal to 300 μm. Components to be produced in the powder bed region are manufactured by each of the laser beams, and each individual surface contour of the component is manufactured solely by one of the laser beams.
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公开(公告)号:US20190270161A1
公开(公告)日:2019-09-05
申请号:US16408557
申请日:2019-05-10
Applicant: TRUMPF Laser- und Systemtechnik GmbH
Inventor: Matthias Allenberg-Rabe , Jürgen Ortmann
IPC: B23K26/082 , B22F3/105 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B23K26/34 , B23K26/354
Abstract: The present disclosure relates to calibrating scanner devices for positioning laser beams in a processing field, and includes, e.g.: arranging a retroreflector in the processing field of the scanner device, the processing field being formed in a processing chamber for irradiating powder layers; detecting laser radiation reflected back into the scanner device when the laser beam passes over the retroreflector; determining an actual position of the laser beam in the processing field using the detected laser radiation; and calibrating the scanner device by correcting a laser beam target position specified for the scanner device in the processing field using the determined actual position of the laser beam in the processing field.
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