专利检索 ap:("TOKYO OHKA KOGYO CO., LTD.") AND inv:"Hideki SAIJO" 第 1 页

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发明申请
RESIN COMPOSITION, METHOD FOR PRODUCING CURED ARTICLE, CURED ARTICLE, FLEXIBLE SUBSTRATE, AND FLEXIBLE DISPLAY 审中-公开

公开(公告)号：US20180230330A1

公开(公告)日：2018-08-16

申请号：US15887572

申请日：2018-02-02

申请人： TOKYO OHKA KOGYO CO., LTD.

发明人： Hideki SAIJO , Hiroyuki KIKUCHI , Jiro HIKIDA , Dai SHIOTA

IPC分类号： C09D179/08 , C08L79/08 , B05D3/00

CPC分类号： C09D179/08 , B05D3/007 , C08G73/1078 , C08L79/08 , G06F1/00 , C08K5/3445 , C08L1/284

摘要： A resin composition resulting in a cured article which is excellent in balance among mechanical strength, surface smoothness, and light transmittance, a method for producing a cured article, a cured article, and a flexible substrate or flexible display including the cured article. The resin composition includes a polyamic acid having a structural unit represented by the following formula (1), a cellulose compound having a weight average molecular weight of 60,000 or less, and an organic solvent. In the formula (1), A is a tetravalent organic group and B is a divalent organic group.