公开(公告)号：US20180012781A1

公开(公告)日：2018-01-11

申请号：US15713800

申请日：2017-09-25

申请人： Tokyo Electron Limited

发明人： Yosuke Kawabuchi ,  Hisashi Kawano ,  Satoru Tanaka ,  Hiroyuki Suzuki ,  Kotaro Oishi ,  Kazuyoshi Shinohara ,  Yuki Yoshida

IPC分类号： H01L21/67 ,  H01L21/02

CPC分类号： H01L21/67051 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/6715

摘要： A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.

公开(公告)号：US09818598B2

公开(公告)日：2017-11-14

申请号：US14809373

申请日：2015-07-27

申请人： TOKYO ELECTRON LIMITED ,  JSR CORPORATION

发明人： Meitoku Aibara ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC分类号： B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  B08B3/08

CPC分类号： H01L21/02057 ,  B08B3/08 ,  H01L21/02041 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6715

摘要： An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US10475638B2

公开(公告)日：2019-11-12

申请号：US15307427

申请日：2015-05-01

申请人： Tokyo Electron Limited

发明人： Kazuyoshi Shinohara ,  Yuki Yoshida

IPC分类号： B08B3/02 ,  H01L21/02 ,  B08B3/08 ,  H01L21/67 ,  F26B21/00 ,  F26B15/04

摘要： A substrate processing apparatus includes a substrate rotating unit 11 configured to hold and rotate a substrate 3; a processing liquid supplying unit 13 configured to supply a processing liquid to the substrate; and a replacement liquid supplying unit 14 configured to supply, to the substrate, a replacement liquid with which the processing liquid supplied from the processing liquid supplying unit is replaced. While the replacement liquid supplying unit 14 supplies the replacement liquid to the substrate, the processing liquid supplying unit 13 supplies the processing liquid to a position on the substrate positioned at an outer peripheral side thereof than a supply position of the replacement liquid to form a liquid film of the processing liquid. It is possible to maintain a state in which the entire surface of the substrate is covered with the liquid film without increasing consumption amount of the replacement liquid.

公开(公告)号：US20190118227A1

公开(公告)日：2019-04-25

申请号：US16215958

申请日：2018-12-11

申请人： Tokyo Electron Limited

发明人： Meitoku AIBARA ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC分类号： B08B3/08 ,  H01L21/02 ,  H01L21/67

摘要： An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US10192758B2

公开(公告)日：2019-01-29

申请号：US15713800

申请日：2017-09-25

申请人： Tokyo Electron Limited

发明人： Yosuke Kawabuchi ,  Hisashi Kawano ,  Satoru Tanaka ,  Hiroyuki Suzuki ,  Kotaro Oishi ,  Kazuyoshi Shinohara ,  Yuki Yoshida

IPC分类号： H01L21/02 ,  H01L21/67

摘要： A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.

公开(公告)号：US09805957B2

公开(公告)日：2017-10-31

申请号：US14296813

申请日：2014-06-05

申请人： Tokyo Electron Limited

发明人： Yosuke Kawabuchi ,  Hisashi Kawano ,  Satoru Tanaka ,  Hiroyuki Suzuki ,  Kotaro Oishi ,  Kazuyoshi Shinohara ,  Yuki Yoshida

IPC分类号： H01L21/67 ,  H01L21/02

CPC分类号： H01L21/67051 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/6715

摘要： A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.

公开(公告)号：US09764345B2

公开(公告)日：2017-09-19

申请号：US14291494

申请日：2014-05-30

申请人： Tokyo Electron Limited

发明人： Yoshihiro Kai ,  Yoshinori Ikeda ,  Kazuyoshi Shinohara ,  Tetsuya Oda ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC分类号： H01L21/67 ,  C03C23/00 ,  B05B15/02

CPC分类号： B05B15/555 ,  C03C23/0075 ,  H01L21/67051 ,  H01L21/6715

摘要： A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.

公开(公告)号：US09768039B2

公开(公告)日：2017-09-19

申请号：US14084839

申请日：2013-11-20

申请人： Tokyo Electron Limited

发明人： Kazuhiro Aiura ,  Norihiro Ito ,  Hidetoshi Nakao ,  Kazuyoshi Shinohara ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67051 ,  H01L21/68735

摘要： A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.

公开(公告)号：US20170047219A1

公开(公告)日：2017-02-16

申请号：US15307427

申请日：2015-05-01

申请人： Tokyo Electron Limited

发明人： Kazuyoshi Shinohara ,  Yuki Yoshida

IPC分类号： H01L21/02 ,  B08B3/08 ,  H01L21/67

CPC分类号： H01L21/02052 ,  B08B3/024 ,  B08B3/08 ,  F26B15/04 ,  F26B21/004 ,  H01L21/67028 ,  H01L21/6704 ,  H01L21/67051

摘要： A substrate processing apparatus includes a substrate rotating unit 11 configured to hold and rotate a substrate 3; a processing liquid supplying unit 13 configured to supply a processing liquid to the substrate; and a replacement liquid supplying unit 14 configured to supply, to the substrate, a replacement liquid with which the processing liquid supplied from the processing liquid supplying unit is replaced. While the replacement liquid supplying unit 14 supplies the replacement liquid to the substrate, the processing liquid supplying unit 13 supplies the processing liquid to a position on the substrate positioned at an outer peripheral side thereof than a supply position of the replacement liquid to form a liquid film of the processing liquid. It is possible to maintain a state in which the entire surface of the substrate is covered with the liquid film without increasing consumption amount of the replacement liquid.

摘要翻译： 基板处理装置包括：基板旋转单元11，被配置为保持和旋转基板3; 处理液供给部13，被配置为向所述基板供给处理液; 以及更换液体供给单元14，被配置为向所述基板供给更换从所述处理液供给单元供给的所述处理液的更换液体。 在替换液供给部14将更换液体供给到基板的情况下，处理液供给部13将处理液供给位于其位于其外周侧的基板上的位置，而不是更换液体的供给位置，形成液体 胶片处理液。 可以保持基板的整个表面被液膜覆盖而不增加更换液体的消耗量的状态。

公开(公告)号：US20140352730A1

公开(公告)日：2014-12-04

申请号：US14291494

申请日：2014-05-30

申请人： Tokyo Electron Limited

发明人： Yoshihiro Kai ,  Yoshinori Ikeda ,  Kazuyoshi Shinohara ,  Tetsuya Oda ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC分类号： B08B3/02 ,  B05B15/02

CPC分类号： B05B15/555 ,  C03C23/0075 ,  H01L21/67051 ,  H01L21/6715

摘要： A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.

摘要翻译： 根据本公开的基板处理装置包括将处理液喷射到基板的第一和第二喷嘴; 移动机构，其移动所述第一和第二喷嘴; 以及清洁至少第二喷嘴的喷嘴清洁装置。 喷嘴清洁装置包括清洗槽和溢流槽。 清洗槽包括储存用于清洗第二喷嘴的清洗液的液体储存部分和从液体储存部分排出超过预定水平的清洗液体的溢流部分。 溢流槽设置在清洗槽附近，并接收从溢流部排出的清洗液，并将接收到的清洗液排出到外部。