Inspection apparatus and inspection method

    公开(公告)号:US11761704B2

    公开(公告)日:2023-09-19

    申请号:US17330781

    申请日:2021-05-26

    发明人: Jun Fujihara

    摘要: An inspection apparatus includes: inspection chamber rows in each of which inspection chambers are arranged, the inspection chamber rows arranged in multiple stages and each of the inspection chambers being configured to accommodate therein a tester configured to inspect an inspection object on a chuck top; a refrigerant supplier configured to supply a refrigerant gas; and a controller. The refrigerant supplier includes: a refrigerant gas pipe connecting the chuck tops in each inspection chamber row to allow the refrigerant gas to pass therethrough; and a first heat exchanger disposed in the refrigerant gas pipe between the chuck tops to exchange heat with the refrigerant gas discharged from the chuck tops. Each of the chuck tops includes a heater configured to heat the inspection object and a temperature sensor. The controller is configured to control the heater based on a temperature detected by the temperature sensor.

    Contact release method in inspection apparatus and inspection apparatus

    公开(公告)号:US11467208B2

    公开(公告)日:2022-10-11

    申请号:US17347325

    申请日:2021-06-14

    摘要: A method for releasing contact between probes and a substrate is provided. In a state where the probes are pressed against the substrate to be in contact with the substrate, a pressure is reduced in an inspection space that is surrounded by a substrate support having thereon the substrate, a tubular member attracting and holding the substrate support through a seal member, and a frame to which a probe card is fixed. The method includes raising an alignment mechanism to a predetermined position to be close to the substrate support, subsequently stopping the pressure reduction of the inspection space and supporting the substrate support by the alignment mechanism located at the predetermined position while preventing release of the contact, subsequently lowering the alignment mechanism supporting the substrate support to release the contact, and subsequently stopping the attracting and holding of the substrate support by the tubular member.

    Chuck top, inspection apparatus, and chuck top recovery method

    公开(公告)号:US11385283B2

    公开(公告)日:2022-07-12

    申请号:US16741289

    申请日:2020-01-13

    发明人: Jun Fujihara

    IPC分类号: G01R31/28

    摘要: There is provided a chuck top for use in an inspection apparatus which inspects a plurality of inspection target devices formed on a wafer. The chuck top is configured to be held by a frame during an inspection of the plurality of inspection target devices while holding the wafer, the chuck top being configured to be attachable to and detachable from an aligner. The chuck top includes a main body, and a drop prevention mechanism provided in the main body and including a movable drop prevention hook configured to prevent the chuck top from being dropped when the chuck top is detached from the frame.

    Intermediate connection member and inspection apparatus

    公开(公告)号:US10935570B2

    公开(公告)日:2021-03-02

    申请号:US16506041

    申请日:2019-07-09

    摘要: There is provided an intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals, respectively, the intermediate connection member including: a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; and a pogo frame having an insertion hole into which the pogo block is inserted, wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, and wherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole.

    INSPECTION SYSTEM
    5.
    发明申请
    INSPECTION SYSTEM 审中-公开

    公开(公告)号:US20200158775A1

    公开(公告)日:2020-05-21

    申请号:US16630606

    申请日:2018-05-11

    摘要: An inspection system includes: an inspection section provided with an inspection part having a plurality of inspection units each including a tester that performs an electrical inspection of an inspection target, and a probe card provided between the tester and the inspection target; and a loader section including an arrangement part in which a storage container for the inspection target is disposed, and a loader that delivers the inspection target between the storage container and the inspection section. The inspection part includes a plurality of inspection unit rows that are formed by arranging the plurality of inspection units in one horizontal direction and arranged in a plurality of tiers in a vertical direction. The arrangement part is provided on an end part side in one direction of the inspection part.

    Trolley and method for supporting component of substrate processing apparatus

    公开(公告)号:US12065182B2

    公开(公告)日:2024-08-20

    申请号:US17551988

    申请日:2021-12-15

    IPC分类号: B62B3/02 B62B3/10

    CPC分类号: B62B3/02 B62B3/10

    摘要: A trolley includes a trolley body which in turn includes a wheel that is freely movable on a floor, and a first support that supports a component of a substrate processing apparatus that slides in a lateral direction and is pulled out to an outside of the substrate processing apparatus. The trolley also includes a second support that is connected to the trolley body so as to be freely movable between a first position where a width of the trolley in the lateral direction is a first length and a second position where the width in the lateral direction is a second length longer than the first length, and configured to support the component at the second position together with the first support.

    Inspection apparatus, inspection system, and aligning method

    公开(公告)号:US11169206B2

    公开(公告)日:2021-11-09

    申请号:US16619260

    申请日:2018-04-16

    摘要: The present disclosure is provided with a probe card and a transfer stage for transferring an inspection target toward the probe card. The transfer stage is provided with a chuck top on which the inspection target is mounted, an aligner configured to be contacted to or separated from the chuck top, and an aligning mechanism for aligning the chuck top with the aligner. The aligning mechanism has radially-expandable positioning pins at a plurality of positions on the upper surface of the aligner, and pin insertion members at positions on the lower surface of the chuck top corresponding to the positioning pins, the pin insertion members having pin insertion holes of which diameters are larger than those of the positioning pins that are not radially expanded. The chuck top is aligned with the aligner by inserting the positioning pins into the pin insertion holes and radially expanding the positioning pins.

    Inspection device and contact method

    公开(公告)号:US11099236B2

    公开(公告)日:2021-08-24

    申请号:US16491535

    申请日:2018-02-01

    IPC分类号: G01R31/28 G01R1/073

    摘要: An inspection device includes a chuck top that holds a wafer, a probe card disposed to face the wafer held by the chuck top and having a plurality of contact probes on a surface facing the wafer, a pogo frame that holds the probe card, a bellows that surrounds the probe card and the contact probes and forms a sealed space when the wafer is close to or in contact with the contact probes, a gas exhaust path configured to depressurize the pressure in the sealed space, and a mechanical stopper that is provided between the pogo frame and the chuck top and restricts the vertical inclination of the chuck top when a predetermined contact is made between the wafer and the contact probes.

    Substrate inspection method and substrate inspection device

    公开(公告)号:US10901028B2

    公开(公告)日:2021-01-26

    申请号:US16333737

    申请日:2017-08-25

    IPC分类号: G01R31/28 G01R1/073

    摘要: Provided is a substrate inspection method capable of accurately performing inspection. A wafer inspection device includes a chuck top on which a wafer having a semiconductor device formed thereon is mounted and a probe card disposed above the chuck top so as to face the chuck top. The probe card includes a plurality of contact probes protruding toward the wafer. When bringing the chuck top close to the probe card, a tubular expandable/contractible bellows extending downward from the probe card side so as to surround the contact probes is attracted to the chuck top via a lip seal before the contact probes come into contact with the semiconductor device.

    SUBSTRATE INSPECTION DEVICE
    10.
    发明申请

    公开(公告)号:US20190331731A1

    公开(公告)日:2019-10-31

    申请号:US16335354

    申请日:2017-08-25

    IPC分类号: G01R31/28 G01R31/26 H01L21/67

    摘要: A substrate inspection device includes: a holding member configured to hold a probe card; a plate-shaped chuck facing the probe card and configured to place a substrate thereon; and an inspection chamber in which the holding member and the chuck are disposed. The substrate is brought into contact with the probe card by moving the chuck closer to the holding member. A sealed space is formed between the holding member and the chuck. A contact state between the probe card and the substrate are maintained by decompressing the sealed space. A gas introduction path is provided separately from the inspection chamber and configured to introduce a gas in a partitioned space into the sealed space, and the partitioned space is filled with a dry gas.