ELECTRONIC SYSTEM COMPRISING A MICROELECTROMECHANICAL SYSTEM AND A BOX ENCAPSULATING THIS MICROELECTROMECHANICAL SYSTEM

    公开(公告)号:US20190276307A1

    公开(公告)日:2019-09-12

    申请号:US16293330

    申请日:2019-03-05

    申请人: Thales

    IPC分类号: B81B7/00 B81B7/02

    摘要: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane.The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

    Thermal control device of a component, associated electronic system and platform

    公开(公告)号:US11300332B2

    公开(公告)日:2022-04-12

    申请号:US16232779

    申请日:2018-12-26

    申请人: THALES

    摘要: The present invention relates to a thermal control device of a component, the control device including: a power source, a converter able to convert a temperature variation into a resistance variation, and a cooling module including two faces, a first face at a first temperature and a second face at a second temperature, the difference between the first temperature and the second temperature depending on the current supplying the cooling module, the first face being in, contact with the component, the cooling module, the converter and the power source being arranged electrically so that the current supplying the converter decreases with a temperature increase and the current supplying the cooling module remains constant.

    THERMAL REGULATION SYSTEM FOR AT LEAST ONE ELECTRONIC MODULE EMBEDDED ONBOARD AN AIRCRAFT
    7.
    发明申请
    THERMAL REGULATION SYSTEM FOR AT LEAST ONE ELECTRONIC MODULE EMBEDDED ONBOARD AN AIRCRAFT 审中-公开
    用于嵌入式飞机的最小一个电子模块的热调节系统

    公开(公告)号:US20150241144A1

    公开(公告)日:2015-08-27

    申请号:US14625480

    申请日:2015-02-18

    申请人: THALES

    IPC分类号: F28F9/007 F28D1/02

    摘要: Heat regulation system (1) for at least one equipment item (2) embedded onboard an aircraft, includes a thermal regulation circuit (5) connected to the equipment item(s) (2). The thermal regulation circuit (5) includes a modular thermal regulation device (6) adapted to receive a modifiable number of thermal regulation modules (8).

    摘要翻译: 用于至少一个嵌入在飞行器上的设备项目(2)的热调节系统(1)包括连接到设备项目(2)的热调节电路(5)。 热调节电路(5)包括适于接收可修改数量的热调节模块(8)的模块化热调节装置(6)。

    Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system

    公开(公告)号:US10994988B2

    公开(公告)日:2021-05-04

    申请号:US16293330

    申请日:2019-03-05

    申请人: THALES

    IPC分类号: B81B7/02 B81B7/00

    摘要: The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.

    Heating of an aerodynamic measurement probe

    公开(公告)号:US10667330B2

    公开(公告)日:2020-05-26

    申请号:US15094882

    申请日:2016-04-08

    申请人: THALES

    摘要: An aerodynamic measurement probe comprises a part to be sited in the region of the skin of an aircraft and means for heating the part. The heating means comprise a thermodynamic loop comprising a closed circuit in which a heat-transfer fluid circulates, the closed circuit comprising an evaporator and a zone in which the heat-transfer fluid can be condensed in the appendage in order to heat it. Outside the evaporator, the circuit in which the fluid circulates is formed by a tubular duct of open cross section.