公开(公告)号：US10040975B2

公开(公告)日：2018-08-07

申请号：US15009003

申请日：2016-01-28

申请人： TESA SE

发明人： Thorsten Krawinkel ,  Andreas Junghans

IPC分类号： B32B7/06 ,  C09J7/02 ,  B32B5/04 ,  B32B43/00 ,  C09J7/38 ,  C09J7/26 ,  C09J7/29 ,  C09J153/02 ,  C09J183/04

CPC分类号： C09J7/387 ,  B32B5/04 ,  B32B43/006 ,  C09J7/26 ,  C09J7/29 ,  C09J7/381 ,  C09J153/02 ,  C09J183/04 ,  C09J2201/134 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2201/618 ,  C09J2400/243 ,  C09J2423/105 ,  C09J2453/00 ,  C09J2467/006 ,  C09J2483/00 ,  Y10T156/1142 ,  Y10T428/249983 ,  Y10T428/2848

摘要： A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.