SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20250022730A1

    公开(公告)日:2025-01-16

    申请号:US18767916

    申请日:2024-07-09

    Applicant: TES CO., LTD

    Inventor: Jin-Hyung KIM

    Abstract: The present disclosure relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for detecting tilting or offset of a tray supporting a substrate when a processing process such as a drying process for a substrate using supercritical fluid.

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